Laser induced die transferring and patterning

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

Abstract

The benefits of the use of lasers in the field of assembly of heterogeneous microsystems is demonstrated, by two applications. First, a laser induced pyrolitic process successfully transfers an chip (semiconductior die) from its carrier onto a receiving substrate. Secondly, a laser induced photolitic processes creates a hyhdrophobic/phillic pattern required for fluidic self-alignment of micro-fabricated components
Original languageEnglish
Title of host publicationUnknown
Place of PublicationKarlsruhe, Germany
PublisherIEEE
Pages-
Publication statusPublished - 10 May 2013
EventWorkshop Microassembly: Robotics and Beyond 2013 - Karlsruhe, Germany
Duration: 10 May 201310 May 2013
http://autsys.aalto.fi/en/MicroNanoRobotics/ICRA2013Workshop

Publication series

Name
PublisherIEEE

Conference

ConferenceWorkshop Microassembly: Robotics and Beyond 2013
CountryGermany
CityKarlsruhe
Period10/05/1310/05/13
Internet address

Keywords

  • IR-85902
  • METIS-296012

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