Laser propulsion of microelectronic components: releasing mechanism investigation

N. Karlitskaya, J. Meijer, D.F. de Lange, Henk Kettelarij

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

16 Citations (Scopus)

Abstract

Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.
Original languageEnglish
Title of host publicationHigh-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA
EditorsClaude R. Phipps
Place of PublicationBellingham, USA
PublisherSPIE - The International Society for Optical Engineering
Pages62612P-1-62612P-10
Number of pages10
ISBN (Print)0-8194-6326-4
DOIs
Publication statusPublished - 7 May 2006

Publication series

NameProceedings of SPIE
PublisherSPIE
Number0277-786X
Volume6261
ISSN (Print)0277-786X

Fingerprint

Microelectronics
Propulsion
Lasers
High power lasers
Launching
Ablation
Satellites
Polymers
Hot Temperature

Keywords

  • METIS-232373
  • IR-96139

Cite this

Karlitskaya, N., Meijer, J., de Lange, D. F., & Kettelarij, H. (2006). Laser propulsion of microelectronic components: releasing mechanism investigation. In C. R. Phipps (Ed.), High-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA (pp. 62612P-1-62612P-10). (Proceedings of SPIE; Vol. 6261, No. 0277-786X). Bellingham, USA: SPIE - The International Society for Optical Engineering. https://doi.org/10.1117/12.673815
Karlitskaya, N. ; Meijer, J. ; de Lange, D.F. ; Kettelarij, Henk. / Laser propulsion of microelectronic components: releasing mechanism investigation. High-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA. editor / Claude R. Phipps. Bellingham, USA : SPIE - The International Society for Optical Engineering, 2006. pp. 62612P-1-62612P-10 (Proceedings of SPIE; 0277-786X).
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Karlitskaya, N, Meijer, J, de Lange, DF & Kettelarij, H 2006, Laser propulsion of microelectronic components: releasing mechanism investigation. in CR Phipps (ed.), High-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA. Proceedings of SPIE, no. 0277-786X, vol. 6261, SPIE - The International Society for Optical Engineering, Bellingham, USA, pp. 62612P-1-62612P-10. https://doi.org/10.1117/12.673815

Laser propulsion of microelectronic components: releasing mechanism investigation. / Karlitskaya, N.; Meijer, J.; de Lange, D.F.; Kettelarij, Henk.

High-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA. ed. / Claude R. Phipps. Bellingham, USA : SPIE - The International Society for Optical Engineering, 2006. p. 62612P-1-62612P-10 (Proceedings of SPIE; Vol. 6261, No. 0277-786X).

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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N2 - Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.

AB - Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.

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Karlitskaya N, Meijer J, de Lange DF, Kettelarij H. Laser propulsion of microelectronic components: releasing mechanism investigation. In Phipps CR, editor, High-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA. Bellingham, USA: SPIE - The International Society for Optical Engineering. 2006. p. 62612P-1-62612P-10. (Proceedings of SPIE; 0277-786X). https://doi.org/10.1117/12.673815