@inproceedings{041bb62295914ab09c8ebb26d6f1bfab,
title = "Laser propulsion of microelectronic components: releasing mechanism investigation",
abstract = "Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.",
keywords = "METIS-232373, IR-96139",
author = "N. Karlitskaya and J. Meijer and {de Lange}, D.F. and Henk Kettelarij",
year = "2006",
month = may,
day = "7",
doi = "10.1117/12.673815",
language = "English",
isbn = "0-8194-6326-4",
series = "Proceedings of SPIE",
publisher = "SPIE",
number = "0277-786X",
pages = "62612P--1--62612P--10",
editor = "Phipps, {Claude R.}",
booktitle = "High-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA",
address = "United States",
note = "High-power laser ablation VI ; Conference date: 05-05-2006 Through 12-05-2006",
}