Laser propulsion of microelectronic components: releasing mechanism investigation

N. Karlitskaya, J. Meijer, D.F. de Lange, Henk Kettelarij

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

21 Citations (Scopus)
8 Downloads (Pure)


Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.
Original languageEnglish
Title of host publicationHigh-power laser ablation VI : Proceedings of SPIE, 5-12 May 2006, Taos, New Mexico, USA
EditorsClaude R. Phipps
Place of PublicationBellingham, USA
Number of pages10
ISBN (Print)0-8194-6326-4
Publication statusPublished - 7 May 2006
EventHigh-power laser ablation VI - Taos, NM, USA
Duration: 5 May 200612 May 2006

Publication series

NameProceedings of SPIE
ISSN (Print)0277-786X


ConferenceHigh-power laser ablation VI
Other5-12 May 2006


  • METIS-232373
  • IR-96139


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