Light turning mirrors for hybrid integration of SiON-based optical waveguides and photo-detectors

F. Çivitci, G. Sengo, A. Driessen, M. Pollnau, A.J. Annema, H. Hoekstra

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    Abstract

    For hybrid integration of an optical chip with an electronic chip containing photo-diodes and processing electronics, light must be coupled from the optical to the electronic chip. This paper presents a method to fabricate quasi-total-internal-reflecting mirrors on an optical chip, placed at an angle of 45° with the chip surface, that enable 90° out-of-plane light coupling between flip-chip bonded chips. The fabrication method utilizes a metal-free, parallel process and is fully compatible with conventional fabrication of optical chips. The mirrors are created using anisotropic etching of 45° facets in a Si substrate, followed by fabrication of the optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained interfaces between optical structure and air direct the output from optical waveguides to out-of-plane photo-detectors on the electronic chip, which is aimed to be flip-chip mounted on the optical chip. For transverse-electric (transverse-magnetic) polarization simulations predict a functional loss of 7% (15%), while 7% (18%) is measured.
    Original languageEnglish
    Pages (from-to)24375-24384
    Number of pages10
    JournalOptics express
    Volume21
    Issue number20
    DOIs
    Publication statusPublished - Oct 2013

    Keywords

    • IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY
    • Subsystem integration and techniques
    • Channeled
    • Micro-optical devices
    • Microstructure fabrication
    • Waveguides
    • Integrated Optics

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