TY - JOUR
T1 - Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections
AU - Blom, M.T.
AU - Chmela, E.
AU - Gardeniers, Johannes G.E.
AU - Berenschot, Johan W.
AU - Elwenspoek, Michael Curt
AU - Tijssen, Robert
AU - van den Berg, Albert
PY - 2001/7
Y1 - 2001/7
N2 - Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.
AB - Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.
U2 - 10.1088/0960-1317/11/4/317
DO - 10.1088/0960-1317/11/4/317
M3 - Article
SN - 0960-1317
VL - 11
SP - 382
EP - 385
JO - Journal of micromechanics and microengineering
JF - Journal of micromechanics and microengineering
IS - 4
ER -