Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

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Abstract

Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.
Original languageUndefined
Pages (from-to)382-385
Number of pages4
JournalJournal of micromechanics and microengineering
Volume11
Issue number4
DOIs
Publication statusPublished - Jul 2001

Keywords

  • METIS-200239
  • EWI-12861
  • IR-42032

Cite this

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title = "Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections",
abstract = "Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.",
keywords = "METIS-200239, EWI-12861, IR-42032",
author = "M.T. Blom and E. Chmela and Gardeniers, {Johannes G.E.} and Berenschot, {Johan W.} and Elwenspoek, {Michael Curt} and R. Tijssen and {van den Berg}, Albert",
year = "2001",
month = "7",
doi = "10.1088/0960-1317/11/4/317",
language = "Undefined",
volume = "11",
pages = "382--385",
journal = "Journal of micromechanics and microengineering",
issn = "0960-1317",
publisher = "IOP Publishing Ltd.",
number = "4",

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TY - JOUR

T1 - Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

AU - Blom, M.T.

AU - Chmela, E.

AU - Gardeniers, Johannes G.E.

AU - Berenschot, Johan W.

AU - Elwenspoek, Michael Curt

AU - Tijssen, R.

AU - van den Berg, Albert

PY - 2001/7

Y1 - 2001/7

N2 - Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.

AB - Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.

KW - METIS-200239

KW - EWI-12861

KW - IR-42032

U2 - 10.1088/0960-1317/11/4/317

DO - 10.1088/0960-1317/11/4/317

M3 - Article

VL - 11

SP - 382

EP - 385

JO - Journal of micromechanics and microengineering

JF - Journal of micromechanics and microengineering

SN - 0960-1317

IS - 4

ER -