Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

M.T. Blom, E. Chmela, Johannes G.E. Gardeniers, Johan W. Berenschot, Michael Curt Elwenspoek, R. Tijssen, Albert van den Berg

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Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.
Original languageUndefined
Pages (from-to)382-385
Number of pages4
JournalJournal of micromechanics and microengineering
Issue number4
Publication statusPublished - Jul 2001


  • METIS-200239
  • EWI-12861
  • IR-42032

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