Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

M.T. Blom; E. Chmela; Johannes G.E. Gardeniers; Johan W. Berenschot; Michael Curt Elwenspoek; R. Tijssen; Albert van den Berg

doi:10.1088/0960-1317/11/4/317

Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

M.T. Blom, E. Chmela, Johannes G.E. Gardeniers, Johan W. Berenschot, Michael Curt Elwenspoek, R. Tijssen, Albert van den Berg

Research output: Contribution to journal › Article › Academic › peer-review

24 Citations (Scopus)

Abstract

Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.

Original language	Undefined
Pages (from-to)	382-385
Number of pages	4
Journal	Journal of micromechanics and microengineering
Volume	11
Issue number	4
DOIs	https://doi.org/10.1088/0960-1317/11/4/317
Publication status	Published - Jul 2001

Keywords

METIS-200239
EWI-12861
IR-42032

Access to Document

10.1088/0960-1317/11/4/317

http://eprints.eemcs.utwente.nl/secure2/12861/01/jmm_11_382.pdf

Cite this

Blom, M. T., Chmela, E., Gardeniers, J. G. E., Berenschot, J. W., Elwenspoek, M. C., Tijssen, R., & van den Berg, A. (2001). Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections. Journal of micromechanics and microengineering, 11(4), 382-385. https://doi.org/10.1088/0960-1317/11/4/317

@article{65f17510aef845ffba8dee8a12471691,

title = "Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections",

abstract = "Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.",

keywords = "METIS-200239, EWI-12861, IR-42032",

author = "M.T. Blom and E. Chmela and Gardeniers, {Johannes G.E.} and Berenschot, {Johan W.} and Elwenspoek, {Michael Curt} and R. Tijssen and {van den Berg}, Albert",

year = "2001",

month = "7",

doi = "10.1088/0960-1317/11/4/317",

language = "Undefined",

volume = "11",

pages = "382--385",

journal = "Journal of micromechanics and microengineering",

issn = "0960-1317",

publisher = "IOP Publishing Ltd.",

number = "4",

}

Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections. / Blom, M.T.; Chmela, E.; Gardeniers, Johannes G.E.; Berenschot, Johan W.; Elwenspoek, Michael Curt; Tijssen, R.; van den Berg, Albert.

In: Journal of micromechanics and microengineering, Vol. 11, No. 4, 07.2001, p. 382-385.

Research output: Contribution to journal › Article › Academic › peer-review

TY - JOUR

T1 - Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

AU - Blom, M.T.

AU - Chmela, E.

AU - Gardeniers, Johannes G.E.

AU - Berenschot, Johan W.

AU - Elwenspoek, Michael Curt

AU - Tijssen, R.

AU - van den Berg, Albert

PY - 2001/7

Y1 - 2001/7

N2 - Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.

AB - Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.

KW - METIS-200239

KW - EWI-12861

KW - IR-42032

U2 - 10.1088/0960-1317/11/4/317

DO - 10.1088/0960-1317/11/4/317

M3 - Article

VL - 11

SP - 382

EP - 385

JO - Journal of micromechanics and microengineering

JF - Journal of micromechanics and microengineering

SN - 0960-1317

IS - 4

ER -