Local distribution of particles deposited on patterned surfaces

F. Wali, D. Martin Knotter, Twan Bearda, Paul W. Mertens

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    In many process steps of integrated circuits (IC’s) fabrication, silicon wafers are coming in contact with process liquids such as ultra pure water (UPW) and aqueous and non-aqueous chemical mixtures. During these process steps, liquid-borne particle contamination can deposit on the wafer surface. Particle contamination from UPW is an important factor influencing random yield loss of IC’s [1]. A number of yield models are used to predict yields including Poisson, Murphy, Seeds, and negative binomial models [2,3]. However, these models are based on the assumption that particles are randomly deposited on the wafer surface [4].
    Original languageUndefined
    Article number10.4028/www.scientific.net/SSP.145-146.65
    Pages (from-to)65-68
    Number of pages4
    JournalSolid state phenomena
    Issue number10.4028/www.scientific.net/SSP.145-146.65
    Publication statusPublished - 6 Jan 2009


    • SC-ICRY: Integrated Circuit Reliability and Yield
    • METIS-263729
    • IR-62726
    • EWI-15029
    • Silica particles
    • Lateral capillary forces
    • Deposition mechanism

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