Abstract
| Original language | Undefined |
|---|---|
| Title of host publication | Proceedings of Micromechanics Europe '99 Conference |
| Place of Publication | Gif-sur-Yvette, France |
| Pages | 81-84 |
| Number of pages | 4 |
| Publication status | Published - 27 Sep 1999 |
| Event | 10th Micromechanics Europe Workshop, MME 1999 - Gif-sur-Yvette, France Duration: 27 Sep 1999 → 28 Sep 1999 Conference number: 10 |
Workshop
| Workshop | 10th Micromechanics Europe Workshop, MME 1999 |
|---|---|
| Abbreviated title | MME |
| Country | France |
| City | Gif-sur-Yvette |
| Period | 27/09/99 → 28/09/99 |
Keywords
- IR-15826
- METIS-112708
Cite this
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Low-cost piezoresistive silicon load cell independent of force distribution. / Zwijze, A.F.; Wiegerink, Remco J.; Krijnen, Gijsbertus J.M.; Lammerink, Theodorus S.J.; Elwenspoek, Michael Curt.
Proceedings of Micromechanics Europe '99 Conference. Gif-sur-Yvette, France, 1999. p. 81-84.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
TY - GEN
T1 - Low-cost piezoresistive silicon load cell independent of force distribution
AU - Zwijze, A.F.
AU - Wiegerink, Remco J.
AU - Krijnen, Gijsbertus J.M.
AU - Lammerink, Theodorus S.J.
AU - Elwenspoek, Michael Curt
PY - 1999/9/27
Y1 - 1999/9/27
N2 - A silicon load cell (force sensor) is presented which is based on a new operating principle. The force is measured by compressing a meander like strain gage. A second strain gage which is not loaded, is used for temperature compensation and for compensation of bending and stretching stresses in the chip. Also, same changes in zero load resistor values are eliminated. It is shown that the output of the bridge is a linear function of the total force and independent of the force distribution on the silicon chip. Measurements up to 1000 kg show a linear respons and a short term repeatability which is within 0.1 %. Creep after 30 minutes is within 1.2 %.
AB - A silicon load cell (force sensor) is presented which is based on a new operating principle. The force is measured by compressing a meander like strain gage. A second strain gage which is not loaded, is used for temperature compensation and for compensation of bending and stretching stresses in the chip. Also, same changes in zero load resistor values are eliminated. It is shown that the output of the bridge is a linear function of the total force and independent of the force distribution on the silicon chip. Measurements up to 1000 kg show a linear respons and a short term repeatability which is within 0.1 %. Creep after 30 minutes is within 1.2 %.
KW - IR-15826
KW - METIS-112708
M3 - Conference contribution
SP - 81
EP - 84
BT - Proceedings of Micromechanics Europe '99 Conference
CY - Gif-sur-Yvette, France
ER -