Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

N.B. Palacios-Aguilera; J. Bastemeijer; J.R. Mollinger; A. Bossche; V.R.S.S. Mokkapati; Roy Visser; Remko Akkerman

Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

N.B. Palacios-Aguilera, J. Bastemeijer, J.R. Mollinger, A. Bossche, V.R.S.S. Mokkapati, Roy Visser, Remko Akkerman

Faculty of Engineering Technology

Research output: Contribution to journal › Article › Academic › peer-review

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Abstract

Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work

Original language	English
Pages (from-to)	11-21
Number of pages	11
Journal	International journal on advances in systems and measurements
Volume	5
Issue number	1-2
Publication status	Published - 2012

Keywords

IR-80964
METIS-287303

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2012_Int._J.__Adv._Systems_and_Meas._Microfluidics-Berenice

http://www.iariajournals.org/systems_and_measurements/index.html

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Palacios-Aguilera, N. B., Bastemeijer, J., Mollinger, J. R., Bossche, A., Mokkapati, V. R. S. S., Visser, R., & Akkerman, R. (2012). Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges. International journal on advances in systems and measurements, 5(1-2), 11-21. http://www.iariajournals.org/systems_and_measurements/index.html

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abstract = "Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work",

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author = "N.B. Palacios-Aguilera and J. Bastemeijer and J.R. Mollinger and A. Bossche and V.R.S.S. Mokkapati and Roy Visser and Remko Akkerman",

year = "2012",

language = "English",

volume = "5",

pages = "11--21",

journal = "International journal on advances in systems and measurements",

issn = "1942-261X",

publisher = "International Academy, Research, and Industry Association (IARIA)",

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Palacios-Aguilera, NB, Bastemeijer, J, Mollinger, JR, Bossche, A, Mokkapati, VRSS, Visser, R & Akkerman, R 2012, 'Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges', International journal on advances in systems and measurements, vol. 5, no. 1-2, pp. 11-21. <http://www.iariajournals.org/systems_and_measurements/index.html>

Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges. / Palacios-Aguilera, N.B.; Bastemeijer, J.; Mollinger, J.R. et al.
In: International journal on advances in systems and measurements, Vol. 5, No. 1-2, 2012, p. 11-21.

Research output: Contribution to journal › Article › Academic › peer-review

TY - JOUR

T1 - Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

AU - Palacios-Aguilera, N.B.

AU - Bastemeijer, J.

AU - Mollinger, J.R.

AU - Bossche, A.

AU - Mokkapati, V.R.S.S.

AU - Visser, Roy

AU - Akkerman, Remko

PY - 2012

Y1 - 2012

N2 - Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work

AB - Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work

KW - IR-80964

KW - METIS-287303

M3 - Article

SN - 1942-261X

VL - 5

SP - 11

EP - 21

JO - International journal on advances in systems and measurements

JF - International journal on advances in systems and measurements

IS - 1-2

ER -

Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

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Keywords

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