Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

N.B. Palacios-Aguilera, J. Bastemeijer, J.R. Mollinger, A. Bossche, V.R.S.S. Mokkapati, Roy Visser, Remko Akkerman

Research output: Contribution to journalArticleAcademicpeer-review

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Abstract

Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work
Original languageEnglish
Pages (from-to)11-21
Number of pages11
JournalInternational journal on advances in systems and measurements
Volume5
Issue number1-2
Publication statusPublished - 2012

Keywords

  • IR-80964
  • METIS-287303

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