Low-loss highly tolerant flip-chip couplers for hybrid integration of Si3N4 and polymer waveguides

Jinfeng Mu, Theonitsa Alexoudi, Yean Sheng Yong, Sergio Andrés Vázquez-Córdova, Mindert Dijkstra, Kerstin Worhoff, J. Duis, Sonia Maria García Blanco

Research output: Contribution to journalArticleAcademicpeer-review

2 Citations (Scopus)
2 Downloads (Pure)

Abstract

In this letter, low-loss and highly fabrication-tolerant flip-chip bonded vertical couplers under single-mode condition are demonstrated for the integration of a polymer waveguide chip onto the Si3N4/SiO2 passive platform. The passively aligned vertical couplers have a lateral misalignment between polymer and Si3N4 waveguide cores of ±1.25 μm. Low-loss operation has been experimentally demonstrated over a wide spectral window of 1480-1560 nm, with measured coupler losses below 0.8 dB for Si3N4 taper angles below 1.2°, in good agreement with the calculated values. Furthermore, thermal shock test results show less than 0.1 dB degradation, indicating a robust coupling performance.
Original languageEnglish
Pages (from-to)2748-2751
JournalIEEE photonics technology letters
Volume28
Issue number23
DOIs
Publication statusPublished - 2016

Fingerprint

couplers
Polymers
Waveguides
chips
waveguides
polymers
shock tests
thermal shock
Thermal shock
tapering
misalignment
platforms
degradation
Fabrication
Degradation
fabrication
silicon nitride

Keywords

  • IR-104199
  • METIS-320227

Cite this

Mu, Jinfeng ; Alexoudi, Theonitsa ; Yong, Yean Sheng ; Vázquez-Córdova, Sergio Andrés ; Dijkstra, Mindert ; Worhoff, Kerstin ; Duis, J. ; García Blanco, Sonia Maria. / Low-loss highly tolerant flip-chip couplers for hybrid integration of Si3N4 and polymer waveguides. In: IEEE photonics technology letters. 2016 ; Vol. 28, No. 23. pp. 2748-2751.
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abstract = "In this letter, low-loss and highly fabrication-tolerant flip-chip bonded vertical couplers under single-mode condition are demonstrated for the integration of a polymer waveguide chip onto the Si3N4/SiO2 passive platform. The passively aligned vertical couplers have a lateral misalignment between polymer and Si3N4 waveguide cores of ±1.25 μm. Low-loss operation has been experimentally demonstrated over a wide spectral window of 1480-1560 nm, with measured coupler losses below 0.8 dB for Si3N4 taper angles below 1.2°, in good agreement with the calculated values. Furthermore, thermal shock test results show less than 0.1 dB degradation, indicating a robust coupling performance.",
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Low-loss highly tolerant flip-chip couplers for hybrid integration of Si3N4 and polymer waveguides. / Mu, Jinfeng; Alexoudi, Theonitsa; Yong, Yean Sheng; Vázquez-Córdova, Sergio Andrés; Dijkstra, Mindert; Worhoff, Kerstin; Duis, J.; García Blanco, Sonia Maria.

In: IEEE photonics technology letters, Vol. 28, No. 23, 2016, p. 2748-2751.

Research output: Contribution to journalArticleAcademicpeer-review

TY - JOUR

T1 - Low-loss highly tolerant flip-chip couplers for hybrid integration of Si3N4 and polymer waveguides

AU - Mu, Jinfeng

AU - Alexoudi, Theonitsa

AU - Yong, Yean Sheng

AU - Vázquez-Córdova, Sergio Andrés

AU - Dijkstra, Mindert

AU - Worhoff, Kerstin

AU - Duis, J.

AU - García Blanco, Sonia Maria

PY - 2016

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N2 - In this letter, low-loss and highly fabrication-tolerant flip-chip bonded vertical couplers under single-mode condition are demonstrated for the integration of a polymer waveguide chip onto the Si3N4/SiO2 passive platform. The passively aligned vertical couplers have a lateral misalignment between polymer and Si3N4 waveguide cores of ±1.25 μm. Low-loss operation has been experimentally demonstrated over a wide spectral window of 1480-1560 nm, with measured coupler losses below 0.8 dB for Si3N4 taper angles below 1.2°, in good agreement with the calculated values. Furthermore, thermal shock test results show less than 0.1 dB degradation, indicating a robust coupling performance.

AB - In this letter, low-loss and highly fabrication-tolerant flip-chip bonded vertical couplers under single-mode condition are demonstrated for the integration of a polymer waveguide chip onto the Si3N4/SiO2 passive platform. The passively aligned vertical couplers have a lateral misalignment between polymer and Si3N4 waveguide cores of ±1.25 μm. Low-loss operation has been experimentally demonstrated over a wide spectral window of 1480-1560 nm, with measured coupler losses below 0.8 dB for Si3N4 taper angles below 1.2°, in good agreement with the calculated values. Furthermore, thermal shock test results show less than 0.1 dB degradation, indicating a robust coupling performance.

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