Low-temperature glass bonding for sensor applications

R. Legtenberg, S. Bouwstra, M. Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Micromechanics Europe 1990
Subtitle of host publication	papers from the European Workshop on Micromechanics (MME '90)
Place of Publication	Berlin
Pages	87-92
Number of pages	6
Publication status	Published - 26 Nov 1990
Event	2nd MicroMechanics Europe Workshop, MME 1990 - Berlin, Germany Duration: 26 Nov 1990 → 27 Nov 1990 Conference number: 2

Workshop	2nd MicroMechanics Europe Workshop, MME 1990
Abbreviated title	MME
Country/Territory	Germany
City	Berlin
Period	26/11/90 → 27/11/90

Cite this

@inproceedings{08bf78b999454bbcb611592c8c5cf386,

title = "Low-temperature glass bonding for sensor applications",

author = "R. Legtenberg and S. Bouwstra and M. Elwenspoek",

year = "1990",

month = nov,

day = "26",

language = "English",

pages = "87--92",

booktitle = "Micromechanics Europe 1990",

note = "2nd MicroMechanics Europe Workshop, MME 1990, MME ; Conference date: 26-11-1990 Through 27-11-1990",

}

TY - GEN

T1 - Low-temperature glass bonding for sensor applications

AU - Legtenberg, R.

AU - Bouwstra, S.

AU - Elwenspoek, M.

N1 - Conference code: 2

PY - 1990/11/26

Y1 - 1990/11/26

M3 - Conference contribution

SP - 87

EP - 92

BT - Micromechanics Europe 1990

CY - Berlin

T2 - 2nd MicroMechanics Europe Workshop, MME 1990

Y2 - 26 November 1990 through 27 November 1990

ER -