Low-temperature thermal conductivity of highly porous copper

Gonçalo Tomás; D. Martins; D. Cooper; G. Bonfait

doi:10.1088/1757-899X/101/1/012004

Low-temperature thermal conductivity of highly porous copper

Gonçalo Tomás^*, D. Martins, D. Cooper, G. Bonfait

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	IOP Conference Series: Materials Science and Engineering
DOIs	https://doi.org/10.1088/1757-899X/101/1/012004
Publication status	Published - 2015
Externally published	Yes
Event	20th Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2015 - JW Marriott Starr Pass Resort and Spa, Tucson, United States Duration: 28 Jun 2015 → 2 Jul 2015 Conference number: 20 http://www.cec-icmc.org/cec-icmc-2015/

Conference

Conference	20th Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2015
Abbreviated title	CEC/ICMC
Country/Territory	United States
City	Tucson
Period	28/06/15 → 2/07/15
Internet address	http://www.cec-icmc.org/cec-icmc-2015/

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10.1088/1757-899X/101/1/012004

Cite this

@inproceedings{db12d40ebd154f35a6f98b06923699be,

title = "Low-temperature thermal conductivity of highly porous copper",

author = "Gon{\c c}alo Tom{\'a}s and D. Martins and D. Cooper and G. Bonfait",

year = "2015",

doi = "10.1088/1757-899X/101/1/012004",

language = "English",

booktitle = "IOP Conference Series: Materials Science and Engineering",

note = "20th Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2015, CEC/ICMC ; Conference date: 28-06-2015 Through 02-07-2015",

url = "http://www.cec-icmc.org/cec-icmc-2015/",

}

TY - GEN

T1 - Low-temperature thermal conductivity of highly porous copper

AU - Tomás, Gonçalo

AU - Martins, D.

AU - Cooper, D.

AU - Bonfait, G.

N1 - Conference code: 20

PY - 2015

Y1 - 2015

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84959898983&partnerID=MN8TOARS

U2 - 10.1088/1757-899X/101/1/012004

DO - 10.1088/1757-899X/101/1/012004

M3 - Conference contribution

BT - IOP Conference Series: Materials Science and Engineering

T2 - 20th Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2015

Y2 - 28 June 2015 through 2 July 2015

ER -

Low-temperature thermal conductivity of highly porous copper

Conference

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