Manufacturing and modeling of flat miniature heat pipes in printed circuit board multilayer technology

Wessel Willems Wits, Jacobus B.W. Kok, R. Legtenberg, J. Mannak, J. van Zalk

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageEnglish
    Title of host publicationProceedings of the 14th International Heat Pipe Conference 2007
    Subtitle of host publication22-27 April 2007, Florianopolis, Brazil
    EditorsM.B.H. Mantelli, S. Colle
    PublisherFederal University of Santa Catarina
    Pages169-175
    Publication statusPublished - 22 Apr 2007
    Event14th International Heat Pipe Conference, IHPC 2007 - Florianopolis, Brazil
    Duration: 22 Apr 200727 Apr 2007
    Conference number: 14

    Conference

    Conference14th International Heat Pipe Conference, IHPC 2007
    Abbreviated titleIHPC
    CountryBrazil
    CityFlorianopolis
    Period22/04/0727/04/07

    Cite this

    Wits, W. W., Kok, J. B. W., Legtenberg, R., Mannak, J., & van Zalk, J. (2007). Manufacturing and modeling of flat miniature heat pipes in printed circuit board multilayer technology. In M. B. H. Mantelli, & S. Colle (Eds.), Proceedings of the 14th International Heat Pipe Conference 2007: 22-27 April 2007, Florianopolis, Brazil (pp. 169-175). Federal University of Santa Catarina.