Materials analysis of fluorocarbon films for MEMS applications

J. Elders, Henricus V. Jansen, Michael Curt Elwenspoek

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    In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.
    Original languageUndefined
    Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
    Place of PublicationPiscataway
    Number of pages6
    ISBN (Print)0-7803-1833-1
    Publication statusPublished - 25 Jan 1994
    EventIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994 - Oiso, Japan
    Duration: 25 Jan 199428 Jan 1994
    Conference number: 1994

    Publication series



    WorkshopIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994
    Abbreviated titleMEMS


    • EWI-14073
    • METIS-114104
    • IR-17209

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