Materials analysis of fluorocarbon films for MEMS applications

J. Elders, Henricus V. Jansen, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

8 Citations (Scopus)
50 Downloads (Pure)

Abstract

In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.
Original languageUndefined
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Place of PublicationPiscataway
PublisherIEEE
Pages170-175
Number of pages6
ISBN (Print)0-7803-1833-1
DOIs
Publication statusPublished - 25 Jan 1994
EventIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994 - Oiso, Japan
Duration: 25 Jan 199428 Jan 1994
Conference number: 1994

Publication series

Name
PublisherIEEE

Workshop

WorkshopIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994
Abbreviated titleMEMS
CountryJapan
CityOiso
Period25/01/9428/01/94

Keywords

  • EWI-14073
  • METIS-114104
  • IR-17209

Cite this

Elders, J., Jansen, H. V., & Elwenspoek, M. C. (1994). Materials analysis of fluorocarbon films for MEMS applications. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (pp. 170-175). Piscataway: IEEE. https://doi.org/10.1109/MEMSYS.1994.555618
Elders, J. ; Jansen, Henricus V. ; Elwenspoek, Michael Curt. / Materials analysis of fluorocarbon films for MEMS applications. Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). Piscataway : IEEE, 1994. pp. 170-175
@inproceedings{dbb0a46e0cfa4133b6d53b44b2bad71d,
title = "Materials analysis of fluorocarbon films for MEMS applications",
abstract = "In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.",
keywords = "EWI-14073, METIS-114104, IR-17209",
author = "J. Elders and Jansen, {Henricus V.} and Elwenspoek, {Michael Curt}",
year = "1994",
month = "1",
day = "25",
doi = "10.1109/MEMSYS.1994.555618",
language = "Undefined",
isbn = "0-7803-1833-1",
publisher = "IEEE",
pages = "170--175",
booktitle = "Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)",
address = "United States",

}

Elders, J, Jansen, HV & Elwenspoek, MC 1994, Materials analysis of fluorocarbon films for MEMS applications. in Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). IEEE, Piscataway, pp. 170-175, IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994, Oiso, Japan, 25/01/94. https://doi.org/10.1109/MEMSYS.1994.555618

Materials analysis of fluorocarbon films for MEMS applications. / Elders, J.; Jansen, Henricus V.; Elwenspoek, Michael Curt.

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). Piscataway : IEEE, 1994. p. 170-175.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Materials analysis of fluorocarbon films for MEMS applications

AU - Elders, J.

AU - Jansen, Henricus V.

AU - Elwenspoek, Michael Curt

PY - 1994/1/25

Y1 - 1994/1/25

N2 - In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.

AB - In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.

KW - EWI-14073

KW - METIS-114104

KW - IR-17209

U2 - 10.1109/MEMSYS.1994.555618

DO - 10.1109/MEMSYS.1994.555618

M3 - Conference contribution

SN - 0-7803-1833-1

SP - 170

EP - 175

BT - Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

PB - IEEE

CY - Piscataway

ER -

Elders J, Jansen HV, Elwenspoek MC. Materials analysis of fluorocarbon films for MEMS applications. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE. 1994. p. 170-175 https://doi.org/10.1109/MEMSYS.1994.555618