Materials analysis of fluorocarbon films for MEMS applications

J. Elders; Henricus V. Jansen; Michael Curt Elwenspoek

doi:10.1109/MEMSYS.1994.555618

Materials analysis of fluorocarbon films for MEMS applications

J. Elders, Henricus V. Jansen, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

11 Citations (Scopus)

212 Downloads (Pure)

Abstract

In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.

Original language	Undefined
Title of host publication	Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Place of Publication	Piscataway
Publisher	IEEE
Pages	170-175
Number of pages	6
ISBN (Print)	0-7803-1833-1
DOIs	https://doi.org/10.1109/MEMSYS.1994.555618
Publication status	Published - 25 Jan 1994
Event	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994 - Oiso, Japan Duration: 25 Jan 1994 → 28 Jan 1994 Conference number: 1994

Publication series

Name
Publisher	IEEE

Workshop

Workshop	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994
Abbreviated title	MEMS
Country/Territory	Japan
City	Oiso
Period	25/01/94 → 28/01/94

Keywords

EWI-14073
METIS-114104
IR-17209

Access to Document

10.1109/MEMSYS.1994.555618

Cite this

@inproceedings{dbb0a46e0cfa4133b6d53b44b2bad71d,

title = "Materials analysis of fluorocarbon films for MEMS applications",

abstract = "In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.",

keywords = "EWI-14073, METIS-114104, IR-17209",

author = "J. Elders and Jansen, {Henricus V.} and Elwenspoek, {Michael Curt}",

year = "1994",

month = jan,

day = "25",

doi = "10.1109/MEMSYS.1994.555618",

language = "Undefined",

isbn = "0-7803-1833-1",

publisher = "IEEE",

pages = "170--175",

booktitle = "Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)",

address = "United States",

note = "IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994 ; Conference date: 25-01-1994 Through 28-01-1994",

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TY - GEN

T1 - Materials analysis of fluorocarbon films for MEMS applications

AU - Elders, J.

AU - Jansen, Henricus V.

AU - Elwenspoek, Michael Curt

N1 - Conference code: 1994

PY - 1994/1/25

Y1 - 1994/1/25

N2 - In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.

AB - In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.

KW - EWI-14073

KW - METIS-114104

KW - IR-17209

U2 - 10.1109/MEMSYS.1994.555618

DO - 10.1109/MEMSYS.1994.555618

M3 - Conference contribution

SN - 0-7803-1833-1

SP - 170

EP - 175

BT - Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

PB - IEEE

CY - Piscataway

T2 - IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1994

Y2 - 25 January 1994 through 28 January 1994

ER -