Mechanical decoupling zones for package-stress reduction in micromechanical sensors

V.L. Spiering

    Research output: Contribution to conferencePoster

    Original languageUndefined
    Pages269-271
    Publication statusPublished - 11 Mar 1992
    EventSensortechnologie Conferentie & Workshop 1992: (STW Workshop Sensor Technology) - Koningshof, Veldhoven, Netherlands
    Duration: 11 Mar 199212 Mar 1992

    Conference

    ConferenceSensortechnologie Conferentie & Workshop 1992
    CountryNetherlands
    CityVeldhoven
    Period11/03/9212/03/92

    Keywords

    • METIS-133512

    Cite this

    Spiering, V. L. (1992). Mechanical decoupling zones for package-stress reduction in micromechanical sensors. 269-271. Poster session presented at Sensortechnologie Conferentie & Workshop 1992, Veldhoven, Netherlands.