Mechanical Stress Evolution and the Blech Length: 2D Simulation of Early Electromigration Effects

V. Petrescu; A.J. Mouthaan; W. Schoenmaker; Cora Salm

doi:10.1016/S0026-2714(98)00105-X

Mechanical Stress Evolution and the Blech Length: 2D Simulation of Early Electromigration Effects

V. Petrescu, A.J. Mouthaan, W. Schoenmaker, Cora Salm

Research output: Contribution to journal › Article › Academic › peer-review

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Abstract

Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)c found by Blech [1].

Original language	Undefined
Pages (from-to)	1047-1050
Number of pages	4
Journal	Microelectronics reliability
Volume	38
Issue number	38
DOIs	https://doi.org/10.1016/S0026-2714(98)00105-X
Publication status	Published - 1998

Keywords

IR-73830
METIS-112002

Access to Document

10.1016/S0026-2714(98)00105-X

Cite this

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title = "Mechanical Stress Evolution and the Blech Length: 2D Simulation of Early Electromigration Effects",

abstract = "Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)c found by Blech [1].",

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author = "V. Petrescu and A.J. Mouthaan and W. Schoenmaker and Cora Salm",

year = "1998",

doi = "10.1016/S0026-2714(98)00105-X",

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T1 - Mechanical Stress Evolution and the Blech Length: 2D Simulation of Early Electromigration Effects

AU - Petrescu, V.

AU - Mouthaan, A.J.

AU - Schoenmaker, W.

AU - Salm, Cora

PY - 1998

Y1 - 1998

N2 - Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)c found by Blech [1].

AB - Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)c found by Blech [1].

KW - IR-73830

KW - METIS-112002

U2 - 10.1016/S0026-2714(98)00105-X

DO - 10.1016/S0026-2714(98)00105-X

M3 - Article

SN - 0026-2714

VL - 38

SP - 1047

EP - 1050

JO - Microelectronics reliability

JF - Microelectronics reliability

IS - 38

ER -