Mechanical Stress Evolution and the Blech Length: 2D Simulation of Early Electromigration Effects

V. Petrescu, A.J. Mouthaan, W. Schoenmaker, Cora Salm

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    Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)c found by Blech [1].
    Original languageUndefined
    Pages (from-to)1047-1050
    Number of pages4
    JournalMicroelectronics reliability
    Issue number38
    Publication statusPublished - 1998


    • IR-73830
    • METIS-112002

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