Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief

V.L. Spiering, S. Bouwstra, J.F. Burger, M.C. Elwenspoek

Research output: Contribution to journalArticleAcademicpeer-review

82 Downloads (Pure)

Abstract

Thin square membranes including a deep circular corrugation are realized and tested for application in a strain-based pressure sensor. Package-induced stresses are reduced and relief of the residual stress is obtained, resulting in a larger pressure sensitivity and a reduced temperature sensitivity. Finite element method simulations were carried out, showing that the pressure-deflection behaviour of the structure is close to that of a circular membrane with clamped edge but free radial motion.
Original languageEnglish
Pages (from-to)243-246
Number of pages4
JournalJournal of micromechanics and microengineering
Volume3
Issue number4
DOIs
Publication statusPublished - Dec 1993
Event4th MicroMechanics Europe Workshop, MME 1993 - Neuchatel
Duration: 7 Sep 19938 Sep 1993
Conference number: 4

Fingerprint Dive into the research topics of 'Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief'. Together they form a unique fingerprint.

Cite this