MEMS test structure for measuring thermal conductivity of thin films

L. La Spina; N. Nenadović; A.W. van Herwaarden; H. Schellevis; W.H.A. Wien; L.K. Nanver

doi:10.1109/ICMTS.2006.1614291

MEMS test structure for measuring thermal conductivity of thin films

L. La Spina^*, N. Nenadović, A.W. van Herwaarden, H. Schellevis, W.H.A. Wien, L.K. Nanver

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

14 Citations (Scopus)

Abstract

A novel MEMS test structure and measurement procedure is presented with which the lateral thermal conductivity of thin films can be easily and accurately extracted. The extraction procedure is discussed in detail and supported by numerical simulations. Experimental examples are given for the determination of the lateral thermal conductivity of aluminium (Al), aluminium nitride (AIM), and p-doped polysilicon (polySi) thin films.

Original language	English
Title of host publication	2006 International Conference on Microelectronic Test Structures
Subtitle of host publication	Digest of Technical Papers
Pages	137-142
Number of pages	6
Volume	2006
DOIs	https://doi.org/10.1109/ICMTS.2006.1614291
Publication status	Published - 13 Oct 2006
Externally published	Yes
Event	International Conference on Microelectronic Test Structures 2006 - Austin, United States Duration: 6 Mar 2006 → 9 Mar 2006 http://www.homepages.ed.ac.uk/ajw/ICMTS/

Conference

Conference	International Conference on Microelectronic Test Structures 2006
Abbreviated title	ICMTS 2006
Country/Territory	United States
City	Austin
Period	6/03/06 → 9/03/06
Internet address	http://www.homepages.ed.ac.uk/ajw/ICMTS/

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10.1109/ICMTS.2006.1614291

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title = "MEMS test structure for measuring thermal conductivity of thin films",

abstract = "A novel MEMS test structure and measurement procedure is presented with which the lateral thermal conductivity of thin films can be easily and accurately extracted. The extraction procedure is discussed in detail and supported by numerical simulations. Experimental examples are given for the determination of the lateral thermal conductivity of aluminium (Al), aluminium nitride (AIM), and p-doped polysilicon (polySi) thin films.",

author = "{La Spina}, L. and N. Nenadovi{\'c} and {van Herwaarden}, A.W. and H. Schellevis and W.H.A. Wien and L.K. Nanver",

year = "2006",

month = oct,

day = "13",

doi = "10.1109/ICMTS.2006.1614291",

language = "English",

isbn = "1424401674",

volume = "2006",

pages = "137--142",

booktitle = "2006 International Conference on Microelectronic Test Structures",

note = "International Conference on Microelectronic Test Structures 2006, ICMTS 2006 ; Conference date: 06-03-2006 Through 09-03-2006",

url = "http://www.homepages.ed.ac.uk/ajw/ICMTS/",

}

La Spina, L, Nenadović, N, van Herwaarden, AW, Schellevis, H, Wien, WHA & Nanver, LK 2006, MEMS test structure for measuring thermal conductivity of thin films. in 2006 International Conference on Microelectronic Test Structures: Digest of Technical Papers. vol. 2006, 1614291, pp. 137-142, International Conference on Microelectronic Test Structures 2006, Austin, Texas, United States, 6/03/06. https://doi.org/10.1109/ICMTS.2006.1614291

MEMS test structure for measuring thermal conductivity of thin films. / La Spina, L.; Nenadović, N.; van Herwaarden, A.W. et al.
2006 International Conference on Microelectronic Test Structures: Digest of Technical Papers. Vol. 2006 2006. p. 137-142 1614291.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - MEMS test structure for measuring thermal conductivity of thin films

AU - La Spina, L.

AU - Nenadović, N.

AU - van Herwaarden, A.W.

AU - Schellevis, H.

AU - Wien, W.H.A.

AU - Nanver, L.K.

PY - 2006/10/13

Y1 - 2006/10/13

N2 - A novel MEMS test structure and measurement procedure is presented with which the lateral thermal conductivity of thin films can be easily and accurately extracted. The extraction procedure is discussed in detail and supported by numerical simulations. Experimental examples are given for the determination of the lateral thermal conductivity of aluminium (Al), aluminium nitride (AIM), and p-doped polysilicon (polySi) thin films.

AB - A novel MEMS test structure and measurement procedure is presented with which the lateral thermal conductivity of thin films can be easily and accurately extracted. The extraction procedure is discussed in detail and supported by numerical simulations. Experimental examples are given for the determination of the lateral thermal conductivity of aluminium (Al), aluminium nitride (AIM), and p-doped polysilicon (polySi) thin films.

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U2 - 10.1109/ICMTS.2006.1614291

DO - 10.1109/ICMTS.2006.1614291

M3 - Conference contribution

AN - SCOPUS:33749506462

SN - 1424401674

SN - 9781424401673

VL - 2006

SP - 137

EP - 142

BT - 2006 International Conference on Microelectronic Test Structures

T2 - International Conference on Microelectronic Test Structures 2006

Y2 - 6 March 2006 through 9 March 2006

ER -

MEMS test structure for measuring thermal conductivity of thin films

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