MEMS within a Swagelok®: a new platform for microfluidic devices

S. Unnikrishnan, Henricus V. Jansen, Johan W. Berenschot, B. Mogulkoc, Michael Curt Elwenspoek

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    11 Citations (Scopus)
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    Abstract

    A novel packaging cum interfacing technique for icrofluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubularsubstrate directly translates into a package and an interface, leading to plug-n-play devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors
    Original languageUndefined
    Article number10.1039/b901856p
    Pages (from-to)1966-1969
    Number of pages8
    JournalLab on a chip
    Volume9
    Issue number13
    DOIs
    Publication statusPublished - 2009

    Keywords

    • EWI-15420
    • TST-FABRICATION
    • IR-67699
    • METIS-263876

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