MEMS within a Swagelok®: a new platform for microfluidic devices

S. Unnikrishnan; Henricus V. Jansen; Johan W. Berenschot; B. Mogulkoc; Michael Curt Elwenspoek

doi:10.1039/b901856p

MEMS within a Swagelok®: a new platform for microfluidic devices

S. Unnikrishnan, Henricus V. Jansen, Johan W. Berenschot, B. Mogulkoc, Michael Curt Elwenspoek

Research output: Contribution to journal › Article › Academic › peer-review

12 Citations (Scopus)

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Abstract

A novel packaging cum interfacing technique for icrofluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubularsubstrate directly translates into a package and an interface, leading to plug-n-play devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors

Original language	English
Pages (from-to)	1966-1969
Number of pages	8
Journal	Lab on a chip
Volume	9
Issue number	13
DOIs	https://doi.org/10.1039/b901856p
Publication status	Published - 2009

Keywords

EWI-15420
TST-FABRICATION
IR-67699
METIS-263876

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10.1039/b901856p

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title = "MEMS within a Swagelok{\textregistered}: a new platform for microfluidic devices",

abstract = "A novel packaging cum interfacing technique for icrofluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubularsubstrate directly translates into a package and an interface, leading to plug-n-play devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok{\textregistered} connectors",

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AU - Unnikrishnan, S.

AU - Jansen, Henricus V.

AU - Berenschot, Johan W.

AU - Mogulkoc, B.

AU - Elwenspoek, Michael Curt

PY - 2009

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N2 - A novel packaging cum interfacing technique for icrofluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubularsubstrate directly translates into a package and an interface, leading to plug-n-play devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors

AB - A novel packaging cum interfacing technique for icrofluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubularsubstrate directly translates into a package and an interface, leading to plug-n-play devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors

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KW - METIS-263876

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DO - 10.1039/b901856p

M3 - Article

SN - 1473-0197

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JF - Lab on a chip

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MEMS within a Swagelok®: a new platform for microfluidic devices

Abstract

Keywords

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