Metal diffusion properties of ultra-thin high-k Sc2O3 films

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Abstract

The diffusion barrier properties of Sc2O3 against metal diffusion were studied. Tin and ruthenium were used as probe materials to study the barrier properties of Sc2O3 in thickness ranges that are of relevance for gate materials. Tin deposition and hydrogen radical etching from Sc2O3 layers of 0.5-1.5 nm thickness, deposited on Ru, show that these Sc2O3 layers effectively block the diffusion of Sn into Ru. We show that Sn adhesion and etching depends strongly on the thickness of the Sc2O3 film. The etch-rate is found to be inversely proportional to the Sc2O3 layer thickness, which we attribute to Sc2O3 becoming a more effective charge transfer barrier at larger thicknesses.

Original languageEnglish
Article number105324
Number of pages21
JournalAIP advances
Volume7
Issue number10
DOIs
Publication statusPublished - 1 Oct 2017

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