Method for coating substrates and mask holder

Frederik Bijkerk (Inventor), Andrey Yakshin (Inventor), Eric Louis (Inventor), M.J.H. Kessels (Inventor), Edward Lambertus Gerardus Maas (Inventor), Caspar Bruineman (Inventor)

Research output: PatentProfessional

Abstract

When coating substrates it is frequently desired that the layer thickness should be a certain function of the position on the substrate to be coated. To control the layer thickness a mask is conventionally arranged between the coating particle source and the substrate. This leads to undesirable shadow effects. In addition, is has so far only been possible to obtain rotationally symmetrical thickness distributions. It is now proposed that masks should be used having apertures aligned according to a regular grid on the mask surface. Such a mask with a mask holder comprising a base frame (2), an intermediate frame (3) and a mask frame (4) which are joined one to the other by means of double hinges (5a, a', b, b'), is moved arbitrarily in the mask plane. By this means arbitrary thickness distributions can be achieved when coating substrates at reasonable cost.

Original languageEnglish
Patent numberUS2004052942
IPCC23C 16/ 04 A I
Priority date14/12/01
Publication statusPublished - 18 Mar 2004

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Cite this

Bijkerk, F., Yakshin, A., Louis, E., Kessels, M. J. H., Maas, E. L. G., & Bruineman, C. (2004). IPC No. C23C 16/ 04 A I. Method for coating substrates and mask holder. (Patent No. US2004052942).
Bijkerk, Frederik (Inventor) ; Yakshin, Andrey (Inventor) ; Louis, Eric (Inventor) ; Kessels, M.J.H. (Inventor) ; Maas, Edward Lambertus Gerardus (Inventor) ; Bruineman, Caspar (Inventor). / Method for coating substrates and mask holder. IPC No.: C23C 16/ 04 A I. Patent No.: US2004052942.
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title = "Method for coating substrates and mask holder",
abstract = "When coating substrates it is frequently desired that the layer thickness should be a certain function of the position on the substrate to be coated. To control the layer thickness a mask is conventionally arranged between the coating particle source and the substrate. This leads to undesirable shadow effects. In addition, is has so far only been possible to obtain rotationally symmetrical thickness distributions. It is now proposed that masks should be used having apertures aligned according to a regular grid on the mask surface. Such a mask with a mask holder comprising a base frame (2), an intermediate frame (3) and a mask frame (4) which are joined one to the other by means of double hinges (5a, a', b, b'), is moved arbitrarily in the mask plane. By this means arbitrary thickness distributions can be achieved when coating substrates at reasonable cost.",
author = "Frederik Bijkerk and Andrey Yakshin and Eric Louis and M.J.H. Kessels and Maas, {Edward Lambertus Gerardus} and Caspar Bruineman",
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Bijkerk, F, Yakshin, A, Louis, E, Kessels, MJH, Maas, ELG & Bruineman, C 2004, Method for coating substrates and mask holder, Patent No. US2004052942, IPC No. C23C 16/ 04 A I.

Method for coating substrates and mask holder. / Bijkerk, Frederik (Inventor); Yakshin, Andrey (Inventor); Louis, Eric (Inventor); Kessels, M.J.H. (Inventor); Maas, Edward Lambertus Gerardus (Inventor); Bruineman, Caspar (Inventor).

IPC No.: C23C 16/ 04 A I. Patent No.: US2004052942.

Research output: PatentProfessional

TY - PAT

T1 - Method for coating substrates and mask holder

AU - Bijkerk, Frederik

AU - Yakshin, Andrey

AU - Louis, Eric

AU - Kessels, M.J.H.

AU - Maas, Edward Lambertus Gerardus

AU - Bruineman, Caspar

PY - 2004/3/18

Y1 - 2004/3/18

N2 - When coating substrates it is frequently desired that the layer thickness should be a certain function of the position on the substrate to be coated. To control the layer thickness a mask is conventionally arranged between the coating particle source and the substrate. This leads to undesirable shadow effects. In addition, is has so far only been possible to obtain rotationally symmetrical thickness distributions. It is now proposed that masks should be used having apertures aligned according to a regular grid on the mask surface. Such a mask with a mask holder comprising a base frame (2), an intermediate frame (3) and a mask frame (4) which are joined one to the other by means of double hinges (5a, a', b, b'), is moved arbitrarily in the mask plane. By this means arbitrary thickness distributions can be achieved when coating substrates at reasonable cost.

AB - When coating substrates it is frequently desired that the layer thickness should be a certain function of the position on the substrate to be coated. To control the layer thickness a mask is conventionally arranged between the coating particle source and the substrate. This leads to undesirable shadow effects. In addition, is has so far only been possible to obtain rotationally symmetrical thickness distributions. It is now proposed that masks should be used having apertures aligned according to a regular grid on the mask surface. Such a mask with a mask holder comprising a base frame (2), an intermediate frame (3) and a mask frame (4) which are joined one to the other by means of double hinges (5a, a', b, b'), is moved arbitrarily in the mask plane. By this means arbitrary thickness distributions can be achieved when coating substrates at reasonable cost.

M3 - Patent

M1 - US2004052942

ER -

Bijkerk F, Yakshin A, Louis E, Kessels MJH, Maas ELG, Bruineman C, inventors. Method for coating substrates and mask holder. C23C 16/ 04 A I. 2004 Mar 18.