Abstract
A method for manufacturing a single crystal nano-structure includes providing a device layer with a 100 structure on a substrate; providing a stress layer onto the device layer; patterning the stress layer along the 110 direction of the device layer; selectively removing parts of the stress layer to obtain exposed parts of the device layer; plane dependent etching of the exposed parts of the device layer to obtain an exposed 111 faces of the device layer; thermally oxidizing the exposed 111 face of the device layer and forming a lateral oxidation layer at an interface of the device layer and the stress layer; providing a mask layer onto the oxidized exposed 111 face of the device layer; removing remaining parts of the stress layer to obtain further exposed parts of the device layer; removing the mask layer; plane dependent etching of the further exposed parts of the device layer to form a single crystal nano-structure with a triangular shaped cross section, until a side of the triangular shaped cross section coplanar to a side of a cross section of the oxidized exposed 111 face is small in comparison with the side of the cross section of the oxidized exposed 111 face.
| Original language | English |
|---|---|
| Patent number | US20120202325 |
| IPC | H01L 21/ 311 A I |
| Priority date | 16/08/10 |
| Publication status | Published - 9 Aug 2012 |
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Method for manufacturing a single crystal nano-wire
van den Berg, A. (Inventor), Bomer,, J. (Inventor), Carlen, T. E. (Inventor), Chen, S. (Inventor), Kraaijenhagen, R. A. (Inventor) & Pinedo, H. M. (Inventor), 17 Feb 2011, IPC No. H01L 29/ 06 A I, Patent No. WO2011019282, Priority date 14 Aug 2009, Priority No. NL20092003357Research output: Patent
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