Method of continuously removing and obtaining diamine tetracetic acid

Heiner Strathmann; Bernd Bauer; Wolfgang Erlmann

Method of continuously removing and obtaining diamine tetracetic acid

Heiner Strathmann (Inventor), Bernd Bauer (Inventor), Wolfgang Erlmann (Inventor)

Research output: Patent

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Abstract

The invention relates to a method of continuously removing and obtaining ethylene diamine tetraacetic acid (EDTA) from the process water of electroless copper plating, and to devices for carrying out this method.
[0002]
In the production of printed circuit boards is frequently necessary to resort to a chemical reaction for the deposition of copper. The most important components of these so-called electroless copper plating baths, apart from copper sulphate and sodium hydroxide are a reducing agent, preferably formaldehyde, and ethylene diamine tetraacetic acid (EDTA) as a complexing agent. As the effectiveness of the reducing agent is usually highly increased with high pH-values, the concentrations for EDTA have to be very high to prevent the precipitation of copper hydroxide. In this process, the EDTA is not chemically modified and therefore not used up during the process. For economic and environmental reasons the EDTA has therefore to be removed and recovered from the process water.

Original language	English
Patent number	EP0416312B1
Priority date	2/11/94
Publication status	Published - 2 Nov 1990

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1 Patent

Verfahren zur kontinuierlichen Entfernung und Gewinnung von Chelatbildungsmitteln aus Prozesswässern
Strathmann, H. (Inventor) & Bauer, B. (Inventor), 1990, Patent No. EP0415119B1, Priority date 30 Mar 1994
Research output: Patent

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@misc{942d3dbec2274d30a98c51f08342cad2,

title = "Method of continuously removing and obtaining diamine tetracetic acid",

abstract = "The invention relates to a method of continuously removing and obtaining ethylene diamine tetraacetic acid (EDTA) from the process water of electroless copper plating, and to devices for carrying out this method.[0002]In the production of printed circuit boards is frequently necessary to resort to a chemical reaction for the deposition of copper. The most important components of these so-called electroless copper plating baths, apart from copper sulphate and sodium hydroxide are a reducing agent, preferably formaldehyde, and ethylene diamine tetraacetic acid (EDTA) as a complexing agent. As the effectiveness of the reducing agent is usually highly increased with high pH-values, the concentrations for EDTA have to be very high to prevent the precipitation of copper hydroxide. In this process, the EDTA is not chemically modified and therefore not used up during the process. For economic and environmental reasons the EDTA has therefore to be removed and recovered from the process water.",

author = "Heiner Strathmann and Bernd Bauer and Wolfgang Erlmann",

note = "Aanvraag octrooi door Derden ; EP0416312B1",

year = "1990",

month = nov,

day = "2",

language = "English",

type = "Patent",

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TY - PAT

T1 - Method of continuously removing and obtaining diamine tetracetic acid

AU - Strathmann, Heiner

AU - Bauer, Bernd

AU - Erlmann, Wolfgang

N1 - Aanvraag octrooi door Derden

PY - 1990/11/2

Y1 - 1990/11/2

N2 - The invention relates to a method of continuously removing and obtaining ethylene diamine tetraacetic acid (EDTA) from the process water of electroless copper plating, and to devices for carrying out this method.[0002]In the production of printed circuit boards is frequently necessary to resort to a chemical reaction for the deposition of copper. The most important components of these so-called electroless copper plating baths, apart from copper sulphate and sodium hydroxide are a reducing agent, preferably formaldehyde, and ethylene diamine tetraacetic acid (EDTA) as a complexing agent. As the effectiveness of the reducing agent is usually highly increased with high pH-values, the concentrations for EDTA have to be very high to prevent the precipitation of copper hydroxide. In this process, the EDTA is not chemically modified and therefore not used up during the process. For economic and environmental reasons the EDTA has therefore to be removed and recovered from the process water.

AB - The invention relates to a method of continuously removing and obtaining ethylene diamine tetraacetic acid (EDTA) from the process water of electroless copper plating, and to devices for carrying out this method.[0002]In the production of printed circuit boards is frequently necessary to resort to a chemical reaction for the deposition of copper. The most important components of these so-called electroless copper plating baths, apart from copper sulphate and sodium hydroxide are a reducing agent, preferably formaldehyde, and ethylene diamine tetraacetic acid (EDTA) as a complexing agent. As the effectiveness of the reducing agent is usually highly increased with high pH-values, the concentrations for EDTA have to be very high to prevent the precipitation of copper hydroxide. In this process, the EDTA is not chemically modified and therefore not used up during the process. For economic and environmental reasons the EDTA has therefore to be removed and recovered from the process water.

M3 - Patent

M1 - EP0416312B1

ER -

Method of continuously removing and obtaining diamine tetracetic acid

Abstract

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Research output

Verfahren zur kontinuierlichen Entfernung und Gewinnung von Chelatbildungsmitteln aus Prozesswässern

Cite this