Micro-assembly of three dimensional tetrahedra by capillary forces

J.W. van Honschoten, A.B.H. Legrain, A. Legrain, Johan W. Berenschot, Leon Abelmann, Niels Roelof Tas

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    4 Citations (Scopus)
    3 Downloads (Pure)

    Abstract

    This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data storage systems.
    Original languageUndefined
    Title of host publication24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
    Place of PublicationUSA
    PublisherIEEE
    Pages288-291
    Number of pages4
    ISBN (Print)978-1-4244-9633-4
    DOIs
    Publication statusPublished - 23 Jan 2011
    Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
    Duration: 23 Jan 201127 Jan 2011
    Conference number: 24

    Publication series

    Name
    PublisherIEEE Robotics & Automation and IEEE Sensors Council

    Conference

    Conference24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
    Abbreviated titleMEMS
    Country/TerritoryMexico
    CityCancun
    Period23/01/1127/01/11

    Keywords

    • METIS-277584
    • IR-76509
    • TST-SMI: Formerly in EWI-SMI
    • TST-Self Assembly
    • EWI-19820

    Cite this