Micro-assembly of three dimensional tetrahedra by capillary forces

J.W. van Honschoten; A.B.H. Legrain; A. Legrain; Johan W. Berenschot; Leon Abelmann; Niels Roelof Tas

doi:10.1109/MEMSYS.2011.5734418

Micro-assembly of three dimensional tetrahedra by capillary forces

J.W. van Honschoten, A.B.H. Legrain, A. Legrain, Johan W. Berenschot, Leon Abelmann, Niels Roelof Tas

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

4 Citations (Scopus)

3 Downloads (Pure)

Abstract

This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data storage systems.

Original language	Undefined
Title of host publication	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Place of Publication	USA
Publisher	IEEE
Pages	288-291
Number of pages	4
ISBN (Print)	978-1-4244-9633-4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734418
Publication status	Published - 23 Jan 2011
Event	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: 23 Jan 2011 → 27 Jan 2011 Conference number: 24

Publication series

Name
Publisher	IEEE Robotics & Automation and IEEE Sensors Council

Conference

Conference	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Abbreviated title	MEMS
Country/Territory	Mexico
City	Cancun
Period	23/01/11 → 27/01/11

Keywords

METIS-277584
IR-76509
TST-SMI: Formerly in EWI-SMI
TST-Self Assembly
EWI-19820

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/MEMSYS.2011.5734418

http://eprints.eemcs.utwente.nl/secure2/19820/01/mems2011_upgraded_version.pdf

Cite this

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title = "Micro-assembly of three dimensional tetrahedra by capillary forces",

abstract = "This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data storage systems.",

keywords = "METIS-277584, IR-76509, TST-SMI: Formerly in EWI-SMI, TST-Self Assembly, EWI-19820",

author = "{van Honschoten}, J.W. and A.B.H. Legrain and A. Legrain and Berenschot, {Johan W.} and Leon Abelmann and Tas, {Niels Roelof}",

note = "10.1109/MEMSYS.2011.5734418 ; 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 ; Conference date: 23-01-2011 Through 27-01-2011",

year = "2011",

month = jan,

day = "23",

doi = "10.1109/MEMSYS.2011.5734418",

language = "Undefined",

isbn = "978-1-4244-9633-4",

publisher = "IEEE",

pages = "288--291",

booktitle = "24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011",

address = "United States",

}

van Honschoten, JW, Legrain, ABH, Legrain, A, Berenschot, JW, Abelmann, L & Tas, NR 2011, Micro-assembly of three dimensional tetrahedra by capillary forces. in 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011. IEEE, USA, pp. 288-291, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 23/01/11. https://doi.org/10.1109/MEMSYS.2011.5734418

TY - GEN

T1 - Micro-assembly of three dimensional tetrahedra by capillary forces

AU - van Honschoten, J.W.

AU - Legrain, A.B.H.

AU - Legrain, A.

AU - Berenschot, Johan W.

AU - Abelmann, Leon

AU - Tas, Niels Roelof

N1 - Conference code: 24

PY - 2011/1/23

Y1 - 2011/1/23

N2 - This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data storage systems.

AB - This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data storage systems.

KW - METIS-277584

KW - IR-76509

KW - TST-SMI: Formerly in EWI-SMI

KW - TST-Self Assembly

KW - EWI-19820

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DO - 10.1109/MEMSYS.2011.5734418

M3 - Conference contribution

SN - 978-1-4244-9633-4

SP - 288

EP - 291

BT - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011

PB - IEEE

CY - USA

T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011

Y2 - 23 January 2011 through 27 January 2011

ER -