Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications

C.J.M. van Rijn, Michael Curt Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    68 Citations (Scopus)
    230 Downloads (Pure)


    With the use of silicon micromachining an inorganic membrane sieve for microfiltration is constructed, having a siliconnitride membrane layer with thickness typically 1 pm and perforations typically between 0.5 pm and 10 pm in diameter. As a support a <lOO>-silicon wafer with openings of loo0 pm in diameter is used. The thin siliconnitride layer is deposited on an initial dense support by means of a suitable Chemical Vapour Deposition method (LPCVD). Perforations in the membrane layer are obtained through the use of standard microlithography and reactive ion etching (RIE). The flow rate behaviour and the pressure strength of the membrane sieve are calculated in a first approximation. A process for manufacturing is presented and some industrial and biomedical applications are discussed.
    Original languageUndefined
    Title of host publicationMicro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
    Place of PublicationPiscataway
    PublisherIEEE Computer Society
    Number of pages6
    ISBN (Print)0-7803-2503-6
    Publication statusPublished - 29 Jan 1995
    EventIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995 - Amsterdam, Netherlands
    Duration: 29 Jan 19952 Feb 1995


    WorkshopIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995
    Abbreviated titleMEMS


    • EWI-13891
    • METIS-114122
    • IR-17227

    Cite this