Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications

C.J.M. van Rijn; Michael Curt Elwenspoek

Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications

C.J.M. van Rijn, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

68 Citations (Scopus)

230 Downloads (Pure)

Abstract

With the use of silicon micromachining an inorganic membrane sieve for microfiltration is constructed, having a siliconnitride membrane layer with thickness typically 1 pm and perforations typically between 0.5 pm and 10 pm in diameter. As a support a <lOO>-silicon wafer with openings of loo0 pm in diameter is used. The thin siliconnitride layer is deposited on an initial dense support by means of a suitable Chemical Vapour Deposition method (LPCVD). Perforations in the membrane layer are obtained through the use of standard microlithography and reactive ion etching (RIE). The flow rate behaviour and the pressure strength of the membrane sieve are calculated in a first approximation. A process for manufacturing is presented and some industrial and biomedical applications are discussed.

Original language	Undefined
Title of host publication	Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
Place of Publication	Piscataway
Publisher	IEEE Computer Society
Pages	83-87
Number of pages	6
ISBN (Print)	0-7803-2503-6
Publication status	Published - 29 Jan 1995
Event	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995 - Amsterdam, Netherlands Duration: 29 Jan 1995 → 2 Feb 1995

Workshop

Workshop	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995
Abbreviated title	MEMS
Country/Territory	Netherlands
City	Amsterdam
Period	29/01/95 → 2/02/95

Keywords

EWI-13891
METIS-114122
IR-17227

Access to Document

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=472549

Cite this

@inproceedings{a1e8b32fa2d4490bbc0f672d5ab09ea3,

title = "Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications",

abstract = "With the use of silicon micromachining an inorganic membrane sieve for microfiltration is constructed, having a siliconnitride membrane layer with thickness typically 1 pm and perforations typically between 0.5 pm and 10 pm in diameter. As a support a -silicon wafer with openings of loo0 pm in diameter is used. The thin siliconnitride layer is deposited on an initial dense support by means of a suitable Chemical Vapour Deposition method (LPCVD). Perforations in the membrane layer are obtained through the use of standard microlithography and reactive ion etching (RIE). The flow rate behaviour and the pressure strength of the membrane sieve are calculated in a first approximation. A process for manufacturing is presented and some industrial and biomedical applications are discussed.",

keywords = "EWI-13891, METIS-114122, IR-17227",

author = "{van Rijn}, C.J.M. and Elwenspoek, {Michael Curt}",

year = "1995",

month = jan,

day = "29",

language = "Undefined",

isbn = "0-7803-2503-6",

pages = "83--87",

booktitle = "Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE",

publisher = "IEEE Computer Society",

address = "United States",

note = "null ; Conference date: 29-01-1995 Through 02-02-1995",

}

van Rijn, CJM & Elwenspoek, MC 1995, Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications. in Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE. IEEE Computer Society, Piscataway, pp. 83-87, IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995, Amsterdam, Netherlands, 29/01/95. <http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=472549>

Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications. / van Rijn, C.J.M.; Elwenspoek, Michael Curt.

Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE. Piscataway : IEEE Computer Society, 1995. p. 83-87.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Micro filtration membrane sieve with silicon micro machining for industrial and biomedical applications

AU - van Rijn, C.J.M.

AU - Elwenspoek, Michael Curt

PY - 1995/1/29

Y1 - 1995/1/29

N2 - With the use of silicon micromachining an inorganic membrane sieve for microfiltration is constructed, having a siliconnitride membrane layer with thickness typically 1 pm and perforations typically between 0.5 pm and 10 pm in diameter. As a support a -silicon wafer with openings of loo0 pm in diameter is used. The thin siliconnitride layer is deposited on an initial dense support by means of a suitable Chemical Vapour Deposition method (LPCVD). Perforations in the membrane layer are obtained through the use of standard microlithography and reactive ion etching (RIE). The flow rate behaviour and the pressure strength of the membrane sieve are calculated in a first approximation. A process for manufacturing is presented and some industrial and biomedical applications are discussed.

AB - With the use of silicon micromachining an inorganic membrane sieve for microfiltration is constructed, having a siliconnitride membrane layer with thickness typically 1 pm and perforations typically between 0.5 pm and 10 pm in diameter. As a support a -silicon wafer with openings of loo0 pm in diameter is used. The thin siliconnitride layer is deposited on an initial dense support by means of a suitable Chemical Vapour Deposition method (LPCVD). Perforations in the membrane layer are obtained through the use of standard microlithography and reactive ion etching (RIE). The flow rate behaviour and the pressure strength of the membrane sieve are calculated in a first approximation. A process for manufacturing is presented and some industrial and biomedical applications are discussed.

KW - EWI-13891

KW - METIS-114122

KW - IR-17227

M3 - Conference contribution

SN - 0-7803-2503-6

SP - 83

EP - 87

BT - Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE

PB - IEEE Computer Society

CY - Piscataway

Y2 - 29 January 1995 through 2 February 1995

ER -