Microchip post-processing: There is plenty of room at the top

Jurriaan Schmitz*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

2 Citations (Scopus)

Abstract

This chapter discusses the addition of new functions to CMOS chips, focusing on post-processing. The author considers the restrictions imposed by thermal budget and pattern density on the choice of where in the chip one should add the new functional devices. The chapter also discusses a variety of commercial and emerging IC microsystems. Today, semiconductor processing is now the most developed fabrication approach and offers many possibilities for the realization of tiny, high-performance electronic systems. Post-processing of CMOS microchips is an attractive approach to make systems with “more-than-Moore” functionality. It makes good use of the existing CMOS infrastructure to obtain an excellent electronic backbone, while the post-processing can be carried out in relative freedom, as long as the boundary conditions, such as thermal budget and stress containment, are properly addressed. Controlled Vocabulary Terms CMOS integrated circuits; micromechanical devices; thermal analysis

Original languageEnglish
Title of host publicationFuture Trends in Microelectronics
Subtitle of host publicationFrontiers and Innovations
EditorsSerge Luryi , Jimmy Xu, Alex Zaslavsky
PublisherWiley
Pages110-119
Number of pages10
ISBN (Electronic)9781118678107
ISBN (Print)9780471212478
DOIs
Publication statusPublished - 1 Jan 2013

Keywords

  • Boundary conditions
  • CMOS chip
  • Microchip post-processing
  • Pattern density
  • Thermal budget

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  • Cite this

    Schmitz, J. (2013). Microchip post-processing: There is plenty of room at the top. In S. Luryi , J. Xu, & A. Zaslavsky (Eds.), Future Trends in Microelectronics: Frontiers and Innovations (pp. 110-119). Wiley. https://doi.org/10.1002/9781118678107.ch8