Microchip post-processing: There is plenty of room at the top

Jurriaan Schmitz*

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

    2 Citations (Scopus)

    Abstract

    This chapter discusses the addition of new functions to CMOS chips, focusing on post-processing. The author considers the restrictions imposed by thermal budget and pattern density on the choice of where in the chip one should add the new functional devices. The chapter also discusses a variety of commercial and emerging IC microsystems. Today, semiconductor processing is now the most developed fabrication approach and offers many possibilities for the realization of tiny, high-performance electronic systems. Post-processing of CMOS microchips is an attractive approach to make systems with “more-than-Moore” functionality. It makes good use of the existing CMOS infrastructure to obtain an excellent electronic backbone, while the post-processing can be carried out in relative freedom, as long as the boundary conditions, such as thermal budget and stress containment, are properly addressed. Controlled Vocabulary Terms CMOS integrated circuits; micromechanical devices; thermal analysis

    Original languageEnglish
    Title of host publicationFuture Trends in Microelectronics
    Subtitle of host publicationFrontiers and Innovations
    EditorsSerge Luryi , Jimmy Xu, Alex Zaslavsky
    PublisherWiley
    Pages110-119
    Number of pages10
    ISBN (Electronic)9781118678107
    ISBN (Print)9780471212478
    DOIs
    Publication statusPublished - 1 Jan 2013

    Keywords

    • Boundary conditions
    • CMOS chip
    • Microchip post-processing
    • Pattern density
    • Thermal budget

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