Microcontact printing and pattern transfer with a tri-layer processing

Y. Chen; A. Lebib; F. Carcenac; H. Launois; G. Schmidt; M. Tormen; G. Muller; L.W. Molenkamp; M. Liebau; Jurriaan Huskens; David Reinhoudt

doi:10.1016/S0167-9317(00)00309-9

Microcontact printing and pattern transfer with a tri-layer processing

Y. Chen, A. Lebib, F. Carcenac, H. Launois, G. Schmidt, M. Tormen, G. Muller, L.W. Molenkamp, M. Liebau, Jurriaan Huskens, David Reinhoudt

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Abstract

We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps

Original language	Undefined
Pages (from-to)	253-256
Journal	Microelectronic engineering
Volume	53
Issue number	1-4
DOIs	https://doi.org/10.1016/S0167-9317(00)00309-9
Publication status	Published - 2000

Keywords

IR-59463

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1016/S0167-9317(00)00309-9

Cite this

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title = "Microcontact printing and pattern transfer with a tri-layer processing",

abstract = "We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps",

keywords = "IR-59463",

author = "Y. Chen and A. Lebib and F. Carcenac and H. Launois and G. Schmidt and M. Tormen and G. Muller and L.W. Molenkamp and M. Liebau and Jurriaan Huskens and David Reinhoudt",

year = "2000",

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TY - JOUR

T1 - Microcontact printing and pattern transfer with a tri-layer processing

AU - Chen, Y.

AU - Lebib, A.

AU - Carcenac, F.

AU - Launois, H.

AU - Schmidt, G.

AU - Tormen, M.

AU - Muller, G.

AU - Molenkamp, L.W.

AU - Liebau, M.

AU - Huskens, Jurriaan

AU - Reinhoudt, David

PY - 2000

Y1 - 2000

N2 - We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps

AB - We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps

KW - IR-59463

U2 - 10.1016/S0167-9317(00)00309-9

DO - 10.1016/S0167-9317(00)00309-9

M3 - Article

SN - 0167-9317

VL - 53

SP - 253

EP - 256

JO - Microelectronic engineering

JF - Microelectronic engineering

IS - 1-4

ER -