Microfluidics within a Swagelok®: A MEMS-on-tube assembly

S. Unnikrishnan, Henricus V. Jansen, Johan W. Berenschot, B. Mogulkoc, Michael Curt Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    7 Citations (Scopus)
    125 Downloads (Pure)


    A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the MEMS is first developed and finally packaged, a reverse approach is shown here that integrates the package with the MEMS either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to ‘plug-n-play’ devices. Maintaining the total size of the MEMS device within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors.
    Original languageUndefined
    Title of host publication22nd IEEE International Conference on Micro Electro Mechanical Systems
    Place of PublicationSorrento, Italy
    PublisherTechnical Digest
    Number of pages4
    ISBN (Print)1084-6999
    Publication statusPublished - 25 Jan 2009
    Event22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
    Duration: 25 Jan 200929 Jan 2009
    Conference number: 22

    Publication series

    PublisherTechnical Digest
    ISSN (Print)1084-6999


    Conference22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
    Abbreviated titleMEMS


    • IR-68788
    • EWI-16940
    • METIS-264206

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