Microfluidics within a Swagelok®: A MEMS-on-tube assembly

S. Unnikrishnan; Henricus V. Jansen; Johan W. Berenschot; B. Mogulkoc; Michael Curt Elwenspoek

doi:10.1109/MEMSYS.2009.4805384

Microfluidics within a Swagelok®: A MEMS-on-tube assembly

S. Unnikrishnan, Henricus V. Jansen, Johan W. Berenschot, B. Mogulkoc, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

7 Citations (Scopus)

193 Downloads (Pure)

Abstract

A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the MEMS is first developed and finally packaged, a reverse approach is shown here that integrates the package with the MEMS either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to ‘plug-n-play’ devices. Maintaining the total size of the MEMS device within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors.

Original language	English
Title of host publication	22nd IEEE International Conference on Micro Electro Mechanical Systems
Place of Publication	Sorrento, Italy
Publisher	Technical Digest
Pages	1-4
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2009.4805384
Publication status	Published - 25 Jan 2009
Event	22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy Duration: 25 Jan 2009 → 29 Jan 2009 Conference number: 22

Conference

Conference	22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
Abbreviated title	MEMS
Country/Territory	Italy
City	Sorrento
Period	25/01/09 → 29/01/09

Keywords

IR-68788
EWI-16940
METIS-264206

Access to Document

10.1109/MEMSYS.2009.4805384

Microfluidics_within_a_Swagelok-SandeepAccepted author version, 594 KB

Cite this

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title = "Microfluidics within a Swagelok{\textregistered}: A MEMS-on-tube assembly",

abstract = "A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the MEMS is first developed and finally packaged, a reverse approach is shown here that integrates the package with the MEMS either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to {\textquoteleft}plug-n-play{\textquoteright} devices. Maintaining the total size of the MEMS device within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok{\textregistered} connectors.",

keywords = "IR-68788, EWI-16940, METIS-264206",

author = "S. Unnikrishnan and Jansen, {Henricus V.} and Berenschot, {Johan W.} and B. Mogulkoc and Elwenspoek, {Michael Curt}",

note = "10.1109/MEMSYS.2009.4805384 ; 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009, MEMS ; Conference date: 25-01-2009 Through 29-01-2009",

year = "2009",

month = jan,

day = "25",

doi = "10.1109/MEMSYS.2009.4805384",

language = "English",

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booktitle = "22nd IEEE International Conference on Micro Electro Mechanical Systems",

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}

Unnikrishnan, S, Jansen, HV, Berenschot, JW, Mogulkoc, B & Elwenspoek, MC 2009, Microfluidics within a Swagelok®: A MEMS-on-tube assembly. in 22nd IEEE International Conference on Micro Electro Mechanical Systems., 10.1109/MEMSYS.2009.4805384, Technical Digest, Sorrento, Italy, pp. 1-4, 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009, Sorrento, Italy, 25/01/09. https://doi.org/10.1109/MEMSYS.2009.4805384

Microfluidics within a Swagelok®: A MEMS-on-tube assembly. / Unnikrishnan, S.; Jansen, Henricus V.; Berenschot, Johan W. et al.

22nd IEEE International Conference on Micro Electro Mechanical Systems. Sorrento, Italy : Technical Digest, 2009. p. 1-4 10.1109/MEMSYS.2009.4805384.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Elwenspoek, Michael Curt

N1 - Conference code: 22

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N2 - A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the MEMS is first developed and finally packaged, a reverse approach is shown here that integrates the package with the MEMS either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to ‘plug-n-play’ devices. Maintaining the total size of the MEMS device within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors.

AB - A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the MEMS is first developed and finally packaged, a reverse approach is shown here that integrates the package with the MEMS either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to ‘plug-n-play’ devices. Maintaining the total size of the MEMS device within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok® connectors.

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Microfluidics within a Swagelok®: A MEMS-on-tube assembly

Abstract

Conference

Keywords

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