Micromachining of {111} plates in <001> oriented silicon

Johan W. Berenschot; R.E. Oosterbroek; Theodorus S.J. Lammerink; Michael Curt Elwenspoek

doi:10.1088/0960-1317/8/2/015

Micromachining of {111} plates in <001> oriented silicon

Johan W. Berenschot, R.E. Oosterbroek, Theodorus S.J. Lammerink, Michael Curt Elwenspoek

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Abstract

We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.

Original language	Undefined
Article number	10.1088/0960-1317/8/2/015
Pages (from-to)	104-107
Number of pages	3
Journal	Journal of micromechanics and microengineering
Volume	1998
Issue number	8
DOIs	https://doi.org/10.1088/0960-1317/8/2/015
Publication status	Published - Jun 1998

Keywords

IR-64952
METIS-129637
EWI-13372

Access to Document

10.1088/0960-1317/8/2/015

JMMM_8_104
open
JMMM_8_104
open

Cite this

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title = "Micromachining of {111} plates in <001> oriented silicon",

abstract = "We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.",

keywords = "IR-64952, METIS-129637, EWI-13372",

author = "Berenschot, {Johan W.} and R.E. Oosterbroek and Lammerink, {Theodorus S.J.} and Elwenspoek, {Michael Curt}",

note = "Paper from the 8th Workshop on Micromachining, Micromechanics and Microsystems (MME'97) held at the Southampton University in Great Britain between 31 August and 2 September 1997",

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AU - Berenschot, Johan W.

AU - Oosterbroek, R.E.

AU - Lammerink, Theodorus S.J.

AU - Elwenspoek, Michael Curt

N1 - Paper from the 8th Workshop on Micromachining, Micromechanics and Microsystems (MME'97) held at the Southampton University in Great Britain between 31 August and 2 September 1997

PY - 1998/6

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N2 - We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.

AB - We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.

KW - IR-64952

KW - METIS-129637

KW - EWI-13372

U2 - 10.1088/0960-1317/8/2/015

DO - 10.1088/0960-1317/8/2/015

M3 - Article

VL - 1998

SP - 104

EP - 107

JO - Journal of micromechanics and microengineering

JF - Journal of micromechanics and microengineering

SN - 0960-1317

IS - 8

M1 - 10.1088/0960-1317/8/2/015

ER -