Micromachining of {111} plates in <001> oriented silicon

Johan W. Berenschot, R.E. Oosterbroek, Theodorus S.J. Lammerink, Michael Curt Elwenspoek

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    Abstract

    We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.
    Original languageUndefined
    Article number10.1088/0960-1317/8/2/015
    Pages (from-to)104-107
    Number of pages3
    JournalJournal of micromechanics and microengineering
    Volume1998
    Issue number8
    DOIs
    Publication statusPublished - Jun 1998

    Keywords

    • IR-64952
    • METIS-129637
    • EWI-13372

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