Abstract
We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.
Original language | Undefined |
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Article number | 10.1088/0960-1317/8/2/015 |
Pages (from-to) | 104-107 |
Number of pages | 3 |
Journal | Journal of micromechanics and microengineering |
Volume | 1998 |
Issue number | 8 |
DOIs | |
Publication status | Published - Jun 1998 |
Keywords
- IR-64952
- METIS-129637
- EWI-13372