TY - JOUR
T1 - Micromachining of {111} plates in <001> oriented silicon
AU - Berenschot, Johan W.
AU - Oosterbroek, R.E.
AU - Lammerink, Theodorus S.J.
AU - Elwenspoek, Michael Curt
N1 - Paper from the 8th Workshop on Micromachining, Micromechanics and Microsystems (MME'97) held at the Southampton University in Great Britain between 31 August and 2 September 1997
PY - 1998/6
Y1 - 1998/6
N2 - We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.
AB - We introduce a new way to micromachine \lbrace111\rbrace oriented plates on \lbrace001\rbrace silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.
U2 - 10.1088/0960-1317/8/2/015
DO - 10.1088/0960-1317/8/2/015
M3 - Article
SN - 0960-1317
VL - 1998
SP - 104
EP - 107
JO - Journal of micromechanics and microengineering
JF - Journal of micromechanics and microengineering
IS - 8
ER -
