Abstract
A microsieve with a very uniform pore size of 260 nm and a pore to pore spacing of 510 nm has been fabricated using multiple exposure interference lithography and (silicon) micro-machining technology. The sieve consists of a 0.1 µm thick silicon nitride membrane perforated with sub-micron diameter pores and a macro perforated silicon support. The calculated clean water flux is at least one to two orders higher than that of conventional inorganic membranes.
Original language | Undefined |
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Pages (from-to) | 170-172 |
Number of pages | 3 |
Journal | Journal of micromechanics and microengineering |
Volume | 9 |
Issue number | 2 |
DOIs | |
Publication status | Published - Jun 1999 |
Keywords
- METIS-111688
- IR-14592
- EWI-13214