Abstract
A microsieve with a very uniform pore size of 260 nm and a pore to pore spacing of 510 nm has been fabricated using multiple exposure interference lithography and (silicon) micro-machining technology. The sieve consists of a 0.1 µm thick silicon nitride membrane perforated with sub-micron diameter pores and a macro perforated silicon support. The calculated clean water flux is at least one to two orders higher than that of conventional inorganic membranes.
| Original language | Undefined |
|---|---|
| Pages (from-to) | 170-172 |
| Number of pages | 3 |
| Journal | Journal of micromechanics and microengineering |
| Volume | 9 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - Jun 1999 |
Keywords
- METIS-111688
- IR-14592
- EWI-13214