Microstructuring using femtosecond pulsed alser ablation

M.N.W. Groenendijk, J. Meijer

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    Abstract

    A self-induced mechanism leading to the formation of periodic microstructures has been observed during femtosecond pulsed laser ablation with a high repetition laser source. The bottom of an ablated area shows two different kinds of microstructures. A periodic ripple or a chaotic columnar structure emerges. It has been observed that the second morphology grows out of the first one dependent mainly on the amount of fired laser pulses. This transition and the influence of several parameters on it are described. Both structures have several variations in morphology. Regarding the possible applications of such structures, this is of special interest. The presented experiments give a fist glimpse of the possible microstructures emerging after ultrafast laser machining. Concerning the physical background of the found phenomena, it has been observed that a liquid phase is present in the ablation process. The formation of ripples is closely linked to that fact. Existing models on ripple formation could not be linked to the ripple spacing found in the experiments.
    Original languageUndefined
    Title of host publicationProceedings 24th International Congress on Applications of Lasers & Electro-Optics 2005 (ICALEO '05), 31 October - 3 Nov 2005, Miami, USA
    EditorsA Ostendorf, A. Hoult, Y. Lu
    Place of PublicationMiami, USA
    PublisherLIA
    PagesM219-M225
    Number of pages7
    ISBN (Print)0-912035-82-X
    Publication statusPublished - 31 Oct 2005
    Event24th International Congress on Applications of Lasers & Electro-Optics, ICALEO 2005 - Miami, United States
    Duration: 31 Oct 20053 Nov 2005
    Conference number: 24

    Publication series

    Name
    PublisherLIA

    Conference

    Conference24th International Congress on Applications of Lasers & Electro-Optics, ICALEO 2005
    Abbreviated titleICALEO
    Country/TerritoryUnited States
    CityMiami
    Period31/10/053/11/05

    Keywords

    • METIS-224873
    • IR-52898

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