Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor

M. Stranczl; Edin Sarajlic; Gijsbertus J.M. Krijnen; H. Fujita; M.A.M. Gijs; C. Yamahata

doi:10.1109/MEMSYS.2011.5734661

Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor

M. Stranczl, Edin Sarajlic, Gijsbertus J.M. Krijnen, H. Fujita, M.A.M. Gijs, C. Yamahata

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

2 Downloads (Pure)

Abstract

We present the design, modeling and characterization of a 3-phase electrostatic rotary stepper micromotor. The proposed motor is a monolithic device fabricated using silicon-on-insulator (SOI) technology. The rotor is suspended with a frictionless flexural pivot bearing and reaches an unprecedented rotational range of 30° (+/- 15°) at 65 V. We have established a mechanical model of the deformation structure and performed finite element analysis (FEA) simulations of the dynamic properties. These studies are consistent with the extensive experimental characterization performed in the quasi-static, transient, and dynamic regimes.

Original language	Undefined
Title of host publication	Proceedings of the 24th IEEE International Conference on Micro Electro Mechanical Systems
Place of Publication	USA
Publisher	IEEE
Pages	1257-1260
Number of pages	4
ISBN (Print)	978-1-4244-9633-4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734661
Publication status	Published - 23 Jan 2011
Event	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: 23 Jan 2011 → 27 Jan 2011 Conference number: 24

Publication series

Name
Publisher	IEEE Micro Electro Mechanical Systems

Conference

Conference	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Abbreviated title	MEMS
Country/Territory	Mexico
City	Cancun
Period	23/01/11 → 27/01/11

Keywords

METIS-277526
EWI-19563
IR-75917

Access to Document

10.1109/MEMSYS.2011.5734661

http://eprints.eemcs.utwente.nl/secure2/19563/01/Modal_analysis_and_modeling_of_a_frictionless_-_Stranczl_-.pdf

Cite this

@inproceedings{160ff870c403448fa1ffdd2610621d93,

title = "Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor",

abstract = "We present the design, modeling and characterization of a 3-phase electrostatic rotary stepper micromotor. The proposed motor is a monolithic device fabricated using silicon-on-insulator (SOI) technology. The rotor is suspended with a frictionless flexural pivot bearing and reaches an unprecedented rotational range of 30° (+/- 15°) at 65 V. We have established a mechanical model of the deformation structure and performed finite element analysis (FEA) simulations of the dynamic properties. These studies are consistent with the extensive experimental characterization performed in the quasi-static, transient, and dynamic regimes.",

keywords = "METIS-277526, EWI-19563, IR-75917",

author = "M. Stranczl and Edin Sarajlic and Krijnen, {Gijsbertus J.M.} and H. Fujita and M.A.M. Gijs and C. Yamahata",

note = "10.1109/MEMSYS.2011.5734661 ; 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 ; Conference date: 23-01-2011 Through 27-01-2011",

year = "2011",

month = jan,

day = "23",

doi = "10.1109/MEMSYS.2011.5734661",

language = "Undefined",

isbn = "978-1-4244-9633-4",

publisher = "IEEE",

pages = "1257--1260",

booktitle = "Proceedings of the 24th IEEE International Conference on Micro Electro Mechanical Systems",

address = "United States",

}

Stranczl, M, Sarajlic, E, Krijnen, GJM, Fujita, H, Gijs, MAM & Yamahata, C 2011, Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor. in Proceedings of the 24th IEEE International Conference on Micro Electro Mechanical Systems. IEEE, USA, pp. 1257-1260, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 23/01/11. https://doi.org/10.1109/MEMSYS.2011.5734661

Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor. / Stranczl, M.; Sarajlic, Edin; Krijnen, Gijsbertus J.M. et al.
Proceedings of the 24th IEEE International Conference on Micro Electro Mechanical Systems. USA: IEEE, 2011. p. 1257-1260.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor

AU - Stranczl, M.

AU - Sarajlic, Edin

AU - Krijnen, Gijsbertus J.M.

AU - Fujita, H.

AU - Gijs, M.A.M.

AU - Yamahata, C.

N1 - Conference code: 24

PY - 2011/1/23

Y1 - 2011/1/23

N2 - We present the design, modeling and characterization of a 3-phase electrostatic rotary stepper micromotor. The proposed motor is a monolithic device fabricated using silicon-on-insulator (SOI) technology. The rotor is suspended with a frictionless flexural pivot bearing and reaches an unprecedented rotational range of 30° (+/- 15°) at 65 V. We have established a mechanical model of the deformation structure and performed finite element analysis (FEA) simulations of the dynamic properties. These studies are consistent with the extensive experimental characterization performed in the quasi-static, transient, and dynamic regimes.

AB - We present the design, modeling and characterization of a 3-phase electrostatic rotary stepper micromotor. The proposed motor is a monolithic device fabricated using silicon-on-insulator (SOI) technology. The rotor is suspended with a frictionless flexural pivot bearing and reaches an unprecedented rotational range of 30° (+/- 15°) at 65 V. We have established a mechanical model of the deformation structure and performed finite element analysis (FEA) simulations of the dynamic properties. These studies are consistent with the extensive experimental characterization performed in the quasi-static, transient, and dynamic regimes.

KW - METIS-277526

KW - EWI-19563

KW - IR-75917

U2 - 10.1109/MEMSYS.2011.5734661

DO - 10.1109/MEMSYS.2011.5734661

M3 - Conference contribution

SN - 978-1-4244-9633-4

SP - 1257

EP - 1260

BT - Proceedings of the 24th IEEE International Conference on Micro Electro Mechanical Systems

PB - IEEE

CY - USA

T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011

Y2 - 23 January 2011 through 27 January 2011

ER -