Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology

Wessel Willems Wits, Jacobus B.W. Kok

Research output: Contribution to journalArticleAcademicpeer-review

8 Citations (Scopus)
Original languageEnglish
Pages (from-to)-
JournalJournal of heat transfer
Volume133
Issue number8
Publication statusPublished - 2011

Keywords

  • METIS-282174

Cite this

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title = "Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology",
keywords = "METIS-282174",
author = "Wits, {Wessel Willems} and Kok, {Jacobus B.W.}",
note = "ASME Digital Library",
year = "2011",
language = "English",
volume = "133",
pages = "--",
journal = "Journal of heat transfer",
issn = "0022-1481",
publisher = "American Society of Mechanical Engineers (ASME)",
number = "8",

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Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology. / Wits, Wessel Willems; Kok, Jacobus B.W.

In: Journal of heat transfer, Vol. 133, No. 8, 2011, p. -.

Research output: Contribution to journalArticleAcademicpeer-review

TY - JOUR

T1 - Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology

AU - Wits, Wessel Willems

AU - Kok, Jacobus B.W.

N1 - ASME Digital Library

PY - 2011

Y1 - 2011

KW - METIS-282174

M3 - Article

VL - 133

SP - -

JO - Journal of heat transfer

JF - Journal of heat transfer

SN - 0022-1481

IS - 8

ER -