Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology

Research output: Contribution to journal › Article › Academic › peer-review

Keywords

@article{c723921f63e64c8db2775b39895709b0,

title = "Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology",

keywords = "METIS-282174",

author = "Wits, \{Wessel Willems\} and Kok, \{Jacobus B.W.\}",

note = "ASME Digital Library ",

year = "2011",

language = "English",

volume = "133",

pages = "--",

journal = "Journal of heat transfer",

issn = "0022-1481",

publisher = "American Society of Mechanical Engineers",

number = "8",

}

TY - JOUR

T1 - Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology

AU - Wits, Wessel Willems

AU - Kok, Jacobus B.W.

N1 - ASME Digital Library

PY - 2011

Y1 - 2011

KW - METIS-282174

M3 - Article

SN - 0022-1481

VL - 133

SP - -

JO - Journal of heat transfer

JF - Journal of heat transfer

IS - 8

ER -