Modeling printed circuit board curvature in relation to manufacturing process steps

G.A. Schuerink, M. Slomp, Wessel W. Wits, R. Legtenberg, E.A. Kappel

Research output: Contribution to journalArticleAcademicpeer-review

6 Citations (Scopus)
261 Downloads (Pure)

Abstract

This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such as bonding, multilayer press cycles and patterning processes. The aim of this research is to develop a model that can be applied to predict laminate deformations in the production of complex PCBs. Initial experimental results of simplified test specimens show that the modeling approach is valid and capable of accurately predicting laminate deformations for standard bi-layer bonding and multiple press cycles. In the future, the evolved model can be used to analyze PCB manufacturing processes and optimize PCB design
Original languageEnglish
Pages (from-to)55-60
JournalProcedia CIRP
Volume9
DOIs
Publication statusPublished - 11 Jun 2013
Event2nd CIRP Global Web Conference, CIRPe 2013: Beyond Modern Manufacturing: Technology for the Factories of the Future - University of Patras, Patras, Greece
Duration: 11 Jun 201312 Jun 2013
Conference number: 2
https://www.facebook.com/CIRP.Web.Conference/posts/182348768569845

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