Modeling printed circuit board curvature in relation to manufacturing process steps

G.A. Schuerink; M. Slomp; Wessel W. Wits; R. Legtenberg; E.A. Kappel

doi:10.1016/j.procir.2013.06.168

Modeling printed circuit board curvature in relation to manufacturing process steps

G.A. Schuerink
, M. Slomp
, Wessel W. Wits
, R. Legtenberg
, E.A. Kappel

Faculty of Engineering Technology

Research output: Contribution to journal › Article › Academic › peer-review

9 Citations (Scopus)

608 Downloads (Pure)

Abstract

This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such as bonding, multilayer press cycles and patterning processes. The aim of this research is to develop a model that can be applied to predict laminate deformations in the production of complex PCBs. Initial experimental results of simplified test specimens show that the modeling approach is valid and capable of accurately predicting laminate deformations for standard bi-layer bonding and multiple press cycles. In the future, the evolved model can be used to analyze PCB manufacturing processes and optimize PCB design

Original language	English
Pages (from-to)	55-60
Journal	Procedia CIRP
Volume	9
DOIs	https://doi.org/10.1016/j.procir.2013.06.168
Publication status	Published - 11 Jun 2013
Event	2nd CIRP Global Web Conference, CIRPe 2013: Beyond Modern Manufacturing: Technology for the Factories of the Future - University of Patras, Patras, Greece Duration: 11 Jun 2013 → 12 Jun 2013 Conference number: 2 https://www.facebook.com/CIRP.Web.Conference/posts/182348768569845

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SDG 9 Industry, Innovation, and Infrastructure

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Cite this

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title = "Modeling printed circuit board curvature in relation to manufacturing process steps",

abstract = "This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such as bonding, multilayer press cycles and patterning processes. The aim of this research is to develop a model that can be applied to predict laminate deformations in the production of complex PCBs. Initial experimental results of simplified test specimens show that the modeling approach is valid and capable of accurately predicting laminate deformations for standard bi-layer bonding and multiple press cycles. In the future, the evolved model can be used to analyze PCB manufacturing processes and optimize PCB design",

author = "G.A. Schuerink and M. Slomp and Wits, \{Wessel W.\} and R. Legtenberg and E.A. Kappel",

year = "2013",

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doi = "10.1016/j.procir.2013.06.168",

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note = "2nd CIRP Global Web Conference, CIRPe 2013 : Beyond Modern Manufacturing: Technology for the Factories of the Future, CIRPe ; Conference date: 11-06-2013 Through 12-06-2013",

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T1 - Modeling printed circuit board curvature in relation to manufacturing process steps

AU - Schuerink, G.A.

AU - Slomp, M.

AU - Wits, Wessel W.

AU - Legtenberg, R.

AU - Kappel, E.A.

N1 - Conference code: 2

PY - 2013/6/11

Y1 - 2013/6/11

N2 - This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such as bonding, multilayer press cycles and patterning processes. The aim of this research is to develop a model that can be applied to predict laminate deformations in the production of complex PCBs. Initial experimental results of simplified test specimens show that the modeling approach is valid and capable of accurately predicting laminate deformations for standard bi-layer bonding and multiple press cycles. In the future, the evolved model can be used to analyze PCB manufacturing processes and optimize PCB design

AB - This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such as bonding, multilayer press cycles and patterning processes. The aim of this research is to develop a model that can be applied to predict laminate deformations in the production of complex PCBs. Initial experimental results of simplified test specimens show that the modeling approach is valid and capable of accurately predicting laminate deformations for standard bi-layer bonding and multiple press cycles. In the future, the evolved model can be used to analyze PCB manufacturing processes and optimize PCB design

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DO - 10.1016/j.procir.2013.06.168

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JF - Procedia CIRP

T2 - 2nd CIRP Global Web Conference, CIRPe 2013

Y2 - 11 June 2013 through 12 June 2013

ER -

Modeling printed circuit board curvature in relation to manufacturing process steps

Abstract

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