Modeling the Stress and Electromigration: the Key to the Main Reliability Problem in Future IC Devices

V. Petrescu, M. Rijnsburger, M. Dekker, A.J. Mouthaan

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of the SAFE'98
    Place of PublicationMierlo
    Number of pages3
    Publication statusPublished - 26 Nov 1998


    • METIS-113839

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