Modeling the Stress and Electromigration: the Key to the Main Reliability Problem in Future IC Devices

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Keywords

@inproceedings{607247dffd5548e1b14ba3f01406f799,

title = "Modeling the Stress and Electromigration: the Key to the Main Reliability Problem in Future IC Devices",

keywords = "METIS-113839",

author = "V. Petrescu and M. Rijnsburger and M. Dekker and A.J. Mouthaan",

year = "1998",

month = nov,

day = "26",

language = "Undefined",

isbn = "90-73461-15-4",

pages = "441--443",

booktitle = "Proceedings of the SAFE'98",

}