Abstract
This paper presents the Hot Carrier Endurance of a High Voltage (100V) self aligned Floating lateral nDMOS transistor. Based on experimental results, a Safe Operating Area is determined according to maximum 10% shift of electrical parameters within 25 years. Process/Device simulation has been done in order to understand the degradation phenomena based on bulk current. Two points of high Impact Ionization rates have been found : one close to the channel junction but in depth, and the second one in the drift region. This later explains the Hot Carrier Degradation of the Ron parameter observed experimentally.
| Original language | English |
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| Pages (from-to) | 1097-1101 |
| Journal | Microelectronics reliability |
| Volume | 38 |
| Issue number | 6-8 |
| DOIs | |
| Publication status | Published - 1998 |