Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

W.W. Wits, J.B.W. Kok

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    Abstract

    The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB). A model based on control volume elements is presented in this paper to analyze the behaviour of flat miniature heat pipes. The advantage of this approach, compared to finite element models, is that the model can be expanded with additional evaporator or condenser components very easily. Actual PCBs with multiple hot spots, cooled by flat miniature heat pipes, and the parameter effects can be analyzed very quickly, without the necessity of complex and time-consuming finite element analysis.
    Original languageEnglish
    Title of host publicationProceedings of the 5th European Thermal Sciences Conference (Eurotherm 2008)
    EditorsA.A. van Steenhoven, T.H. van der Meer, G.G.M. Stoffels
    Place of PublicationEindhoven
    PublisherEindhoven University of Technology
    Number of pages8
    ISBN (Print)978-90-386-1274-4
    Publication statusPublished - 18 May 2008
    Event5th European Thermal-Sciences Conference, Eurotherm 2008 - Eindhoven, Netherlands
    Duration: 18 May 200822 May 2008
    Conference number: 5

    Conference

    Conference5th European Thermal-Sciences Conference, Eurotherm 2008
    Abbreviated titleEurotherm
    CountryNetherlands
    CityEindhoven
    Period18/05/0822/05/08

    Keywords

    • METIS-255234

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