Abstract
The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB). A model based on control volume elements is presented in this paper to analyze the behaviour of flat miniature heat pipes. The advantage of this approach, compared to finite element models, is that the model can be expanded with additional evaporator or condenser components very easily. Actual PCBs with multiple hot spots, cooled by flat miniature heat pipes, and the parameter effects can be analyzed very quickly, without the necessity of complex and time-consuming finite element analysis.
Original language | English |
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Title of host publication | Proceedings of the 5th European Thermal Sciences Conference (Eurotherm 2008) |
Editors | A.A. van Steenhoven, T.H. van der Meer, G.G.M. Stoffels |
Place of Publication | Eindhoven |
Publisher | Eindhoven University of Technology |
Number of pages | 8 |
ISBN (Print) | 978-90-386-1274-4 |
Publication status | Published - 18 May 2008 |
Event | 5th European Thermal-Sciences Conference, Eurotherm 2008 - Eindhoven, Netherlands Duration: 18 May 2008 → 22 May 2008 Conference number: 5 |
Conference
Conference | 5th European Thermal-Sciences Conference, Eurotherm 2008 |
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Abbreviated title | Eurotherm |
Country/Territory | Netherlands |
City | Eindhoven |
Period | 18/05/08 → 22/05/08 |
Keywords
- METIS-255234