Moisture resistance of SU-8 and KMPR as structural material

V.M. Blanco Carballo, J. Melai, Cora Salm, Jurriaan Schmitz

Research output: Contribution to journalArticleAcademicpeer-review

20 Citations (Scopus)

Abstract

This paper treats the moisture resistance of SU-8 and KMPR, two photoresists considered as structural material in microsystems. Our experiments focus on the moisture resistance of newly developed radiation imaging detectors containing these resists. Since these microsystems will be used unpackaged, they are susceptible to all kinds of environmental conditions. Already after 1 day of exposure to a humid condition the structural integrity and adhesion of SU-8 structures, measured by a shear test is drastically reduced. KMPR photoresist shows much stronger moisture resistance properties, making it a suitable alternative in our application.
Original languageUndefined
Article number10.1016/j.mee.2008.12.076
Pages (from-to)765-768
Number of pages4
JournalMicroelectronic engineering
Volume86
Issue number4-6
DOIs
Publication statusPublished - 2009

Keywords

  • KMPR
  • Moisture
  • Adhesion strength
  • EWI-15225
  • SC-RID: Radiation Imaging detectors
  • SU-8
  • CMOS post-processing
  • IR-62786
  • METIS-263780

Cite this

Blanco Carballo, V.M. ; Melai, J. ; Salm, Cora ; Schmitz, Jurriaan. / Moisture resistance of SU-8 and KMPR as structural material. In: Microelectronic engineering. 2009 ; Vol. 86, No. 4-6. pp. 765-768.
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Moisture resistance of SU-8 and KMPR as structural material. / Blanco Carballo, V.M.; Melai, J.; Salm, Cora; Schmitz, Jurriaan.

In: Microelectronic engineering, Vol. 86, No. 4-6, 10.1016/j.mee.2008.12.076, 2009, p. 765-768.

Research output: Contribution to journalArticleAcademicpeer-review

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T1 - Moisture resistance of SU-8 and KMPR as structural material

AU - Blanco Carballo, V.M.

AU - Melai, J.

AU - Salm, Cora

AU - Schmitz, Jurriaan

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KW - KMPR

KW - Moisture

KW - Adhesion strength

KW - EWI-15225

KW - SC-RID: Radiation Imaging detectors

KW - SU-8

KW - CMOS post-processing

KW - IR-62786

KW - METIS-263780

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JO - Microelectronic engineering

JF - Microelectronic engineering

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