Multi-functional 3D printed and embedded sensors for satellite qualification structures

Corey Shemelya; Luis Banuelos-Chacon; Adrian Melendez; Craig Kief; David Espalin; Ryan Wicker; Gijsbertus J.M. Krijnen; Eric MacDonald

doi:10.1109/ICSENS.2015.7370541

Multi-functional 3D printed and embedded sensors for satellite qualification structures

Corey Shemelya, Luis Banuelos-Chacon, Adrian Melendez, Craig Kief, David Espalin, Ryan Wicker, Gijsbertus J.M. Krijnen, Eric MacDonald

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

35 Citations (Scopus)

913 Downloads (Pure)

Abstract

Three dimensional (3D) printing has recently gained attention in a variety of industries ranging from aerospace to biomedical. However, in order to create truly functional 3D printed structures, electronic functionality must be integrated into building sequence. This work explores the integration of both printed sensors (copper capacitive touch sensors) and embedded COTS sensors (surface mount accelerometers) in order to fabricate a space-flight qualification test coupon in the shape of a 1U CubeSat (10 x 10 x 10 cm) as required for stress testing. The 3D printed electronics were fabricated by an enhanced Multi3D 3D Printing system, allowing the direct integration of 3D printed dielectric structures with electronics components fabricated together using a single non-assembly build sequence. Both sensors and structures successfully demonstrated electronic functionality after full encapsulation, and show promise for integration in space based cube satellites.

Original language	Undefined
Title of host publication	Proceedings IEEE Sensors 2015
Place of Publication	Piscataway
Publisher	IEEE
Pages	1422-1425
Number of pages	4
ISBN (Print)	978-1-4799-8203-5
DOIs	https://doi.org/10.1109/ICSENS.2015.7370541
Publication status	Published - 1 Nov 2015
Event	2015 IEEE Sensors - Busan Exhibition and Convention Center, Busan, Korea, Republic of Duration: 1 Nov 2015 → 4 Nov 2015

Publication series

Name
Publisher	IEEE

Conference

Conference	2015 IEEE Sensors
Country/Territory	Korea, Republic of
City	Busan
Period	1/11/15 → 4/11/15

Keywords

EWI-26762
IR-99323
METIS-315575
TST-Life like

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/ICSENS.2015.7370541

IEEE_SENSORS_2015_Multi-functional_3D_Printed_and_Embedded_Sensors_for_Satellite_Qualification_Structures

Cite this

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title = "Multi-functional 3D printed and embedded sensors for satellite qualification structures",

abstract = "Three dimensional (3D) printing has recently gained attention in a variety of industries ranging from aerospace to biomedical. However, in order to create truly functional 3D printed structures, electronic functionality must be integrated into building sequence. This work explores the integration of both printed sensors (copper capacitive touch sensors) and embedded COTS sensors (surface mount accelerometers) in order to fabricate a space-flight qualification test coupon in the shape of a 1U CubeSat (10 x 10 x 10 cm) as required for stress testing. The 3D printed electronics were fabricated by an enhanced Multi3D 3D Printing system, allowing the direct integration of 3D printed dielectric structures with electronics components fabricated together using a single non-assembly build sequence. Both sensors and structures successfully demonstrated electronic functionality after full encapsulation, and show promise for integration in space based cube satellites.",

keywords = "EWI-26762, IR-99323, METIS-315575, TST-Life like",

author = "Corey Shemelya and Luis Banuelos-Chacon and Adrian Melendez and Craig Kief and David Espalin and Ryan Wicker and Krijnen, {Gijsbertus J.M.} and Eric MacDonald",

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doi = "10.1109/ICSENS.2015.7370541",

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AU - Shemelya, Corey

AU - Banuelos-Chacon, Luis

AU - Melendez, Adrian

AU - Kief, Craig

AU - Espalin, David

AU - Wicker, Ryan

AU - Krijnen, Gijsbertus J.M.

AU - MacDonald, Eric

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Y1 - 2015/11/1

N2 - Three dimensional (3D) printing has recently gained attention in a variety of industries ranging from aerospace to biomedical. However, in order to create truly functional 3D printed structures, electronic functionality must be integrated into building sequence. This work explores the integration of both printed sensors (copper capacitive touch sensors) and embedded COTS sensors (surface mount accelerometers) in order to fabricate a space-flight qualification test coupon in the shape of a 1U CubeSat (10 x 10 x 10 cm) as required for stress testing. The 3D printed electronics were fabricated by an enhanced Multi3D 3D Printing system, allowing the direct integration of 3D printed dielectric structures with electronics components fabricated together using a single non-assembly build sequence. Both sensors and structures successfully demonstrated electronic functionality after full encapsulation, and show promise for integration in space based cube satellites.

AB - Three dimensional (3D) printing has recently gained attention in a variety of industries ranging from aerospace to biomedical. However, in order to create truly functional 3D printed structures, electronic functionality must be integrated into building sequence. This work explores the integration of both printed sensors (copper capacitive touch sensors) and embedded COTS sensors (surface mount accelerometers) in order to fabricate a space-flight qualification test coupon in the shape of a 1U CubeSat (10 x 10 x 10 cm) as required for stress testing. The 3D printed electronics were fabricated by an enhanced Multi3D 3D Printing system, allowing the direct integration of 3D printed dielectric structures with electronics components fabricated together using a single non-assembly build sequence. Both sensors and structures successfully demonstrated electronic functionality after full encapsulation, and show promise for integration in space based cube satellites.

KW - EWI-26762

KW - IR-99323

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