Multi-functional 3D printed and embedded sensors for satellite qualification structures

Corey Shemelya, Luis Banuelos-Chacon, Adrian Melendez, Craig Kief, David Espalin, Ryan Wicker, Gijsbertus J.M. Krijnen, Eric MacDonald

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    30 Citations (Scopus)
    596 Downloads (Pure)

    Abstract

    Three dimensional (3D) printing has recently gained attention in a variety of industries ranging from aerospace to biomedical. However, in order to create truly functional 3D printed structures, electronic functionality must be integrated into building sequence. This work explores the integration of both printed sensors (copper capacitive touch sensors) and embedded COTS sensors (surface mount accelerometers) in order to fabricate a space-flight qualification test coupon in the shape of a 1U CubeSat (10 x 10 x 10 cm) as required for stress testing. The 3D printed electronics were fabricated by an enhanced Multi3D 3D Printing system, allowing the direct integration of 3D printed dielectric structures with electronics components fabricated together using a single non-assembly build sequence. Both sensors and structures successfully demonstrated electronic functionality after full encapsulation, and show promise for integration in space based cube satellites.
    Original languageUndefined
    Title of host publicationProceedings IEEE Sensors 2015
    Place of PublicationPiscataway
    PublisherIEEE
    Pages1422-1425
    Number of pages4
    ISBN (Print)978-1-4799-8203-5
    DOIs
    Publication statusPublished - 1 Nov 2015
    Event2015 IEEE Sensors - Busan Exhibition and Convention Center, Busan, Korea, Republic of
    Duration: 1 Nov 20154 Nov 2015

    Publication series

    Name
    PublisherIEEE

    Conference

    Conference2015 IEEE Sensors
    CountryKorea, Republic of
    CityBusan
    Period1/11/154/11/15

    Keywords

    • EWI-26762
    • IR-99323
    • METIS-315575
    • TST-Life like

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