Multi-Physical Design of a Wave Spring Connector for a Highly-Reliable GaN Power Module

Lei Wang, Wenbo Wang, Hueting Raymond J.e., Gert. Rietveld

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
85 Downloads (Pure)

Abstract

Conventional wire bonding in emerging wide bandgap (WBG) semiconductor devices employed in power modules is subjected to failure due to thermo-mechanical stress occurring at the joints. Pressure contact technology improves the reliability of such power modules, eliminating wire bonds between the substrate and components. This paper presents the characteristics and design process of a new type of spring connector in a gallium-nitride (GaN) DC-DC converter for reducing parasitics as well as improving heat dissipation and mechanical stability. Using analytical models and multi-physics finite element method (FEM) simulations, the geometrical design of the spring has been optimized to achieve low parasitics and satisfactory cooling ability, combined with a safe maximum stress. FEM simulations and initial measurement of the optimized spring connector indicate a low inductance ($\sim$3nH) and a low resistance ($\sim 5\mathrm{m}\Omega$).
Original languageEnglish
Title of host publication2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC)
PublisherIEEE
Pages290-295
Number of pages6
ISBN (Print)978-1-6654-9142-6
DOIs
Publication statusPublished - 29 Nov 2022
Event3rd IEEE International Power Electronics and Application Conference and Exposition, PEAC 2022 - Xiamen, China
Duration: 4 Nov 20227 Nov 2022
Conference number: 3

Conference

Conference3rd IEEE International Power Electronics and Application Conference and Exposition, PEAC 2022
Abbreviated titlePEAC 2022
Country/TerritoryChina
CityXiamen
Period4/11/227/11/22

Keywords

  • Connectors
  • Analytical models
  • Contacts
  • Wires
  • Thermomechanical processes
  • Multichip modules
  • Finite element analysis
  • 2023 OA procedure

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