Abstract
A systematic approach to construct an effective multivariate test response model for capturing manufacturing defects in electronic products is described. The effectiveness of the model is demonstrated by its capability in reducing the number of test-points, while achieving the maximal coverage attainable by the specific test method on an industrial circuit.
Original language | English |
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Title of host publication | 15th IEEE European Test Symposium (ETS 2010) |
Place of Publication | USA |
Publisher | IEEE |
Pages | 250-251 |
Number of pages | 1 |
ISBN (Print) | 978-1-4244-5834-9 |
DOIs | |
Publication status | Published - 24 May 2010 |
Event | 15th IEEE European Test Symposium, ETS 2010 - Prague, Czech Republic Duration: 24 May 2010 → 28 May 2010 Conference number: 15 |
Publication series
Name | |
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Publisher | IEEE Computer Society |
ISSN (Print) | 1530-1877 |
Conference
Conference | 15th IEEE European Test Symposium, ETS 2010 |
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Abbreviated title | ETS |
Country/Territory | Czech Republic |
City | Prague |
Period | 24/05/10 → 28/05/10 |
Keywords
- METIS-275791
- IR-75308
- CAES-TDT: Testable Design and Test
- Fault coverage
- EWI-19111
- multivariate testing