Nanomechanical optical devices fabricated with aligned wafer bonding

C. Gui, G.J. Veldhuis, T.M. Koster, Paul Lambeck, Johan W. Berenschot, Johannes G.E. Gardeniers, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

6 Citations (Scopus)
75 Downloads (Pure)

Abstract

This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance
Original languageUndefined
Title of host publicationThe Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings
Place of PublicationPiscataway
PublisherIEEE Computer Society
Pages482-487
Number of pages6
ISBN (Print)0-7803-4412-X
DOIs
Publication statusPublished - 25 Jan 1998
Event11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998 - Heidelberg, Germany
Duration: 25 Jan 199829 Jan 1998
Conference number: 11

Publication series

Name
PublisherIEEE

Workshop

Workshop11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998
Abbreviated titleMEMS
CountryGermany
CityHeidelberg
Period25/01/9829/01/98

Keywords

  • METIS-112755
  • EWI-13471
  • IR-15873

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