Nanomechanical optical devices fabricated with aligned wafer bonding

C. Gui; G.J. Veldhuis; T.M. Koster; Paul Lambeck; Johan W. Berenschot; Johannes G.E. Gardeniers; Michael Curt Elwenspoek

doi:10.1109/MEMSYS.1998.659805

Nanomechanical optical devices fabricated with aligned wafer bonding

C. Gui, G.J. Veldhuis, T.M. Koster, Paul Lambeck, Johan W. Berenschot, Johannes G.E. Gardeniers, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

6 Citations (Scopus)

206 Downloads (Pure)

Abstract

This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance

Original language	Undefined
Title of host publication	The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings
Place of Publication	Piscataway
Publisher	IEEE
Pages	482-487
Number of pages	6
ISBN (Print)	0-7803-4412-X
DOIs	https://doi.org/10.1109/MEMSYS.1998.659805
Publication status	Published - 25 Jan 1998
Event	11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998 - Heidelberg, Germany Duration: 25 Jan 1998 → 29 Jan 1998 Conference number: 11

Publication series

Name
Publisher	IEEE

Workshop

Workshop	11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998
Abbreviated title	MEMS
Country/Territory	Germany
City	Heidelberg
Period	25/01/98 → 29/01/98

Keywords

METIS-112755
EWI-13471
IR-15873

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/MEMSYS.1998.659805

Cite this

@inproceedings{c5197a79d6da4599b53416ca511efa80,

title = "Nanomechanical optical devices fabricated with aligned wafer bonding",

abstract = "This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance",

keywords = "METIS-112755, EWI-13471, IR-15873",

author = "C. Gui and G.J. Veldhuis and T.M. Koster and Paul Lambeck and Berenschot, {Johan W.} and Gardeniers, {Johannes G.E.} and Elwenspoek, {Michael Curt}",

year = "1998",

month = jan,

day = "25",

doi = "10.1109/MEMSYS.1998.659805",

language = "Undefined",

isbn = "0-7803-4412-X",

publisher = "IEEE",

pages = "482--487",

booktitle = "The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings",

address = "United States",

note = "11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998 ; Conference date: 25-01-1998 Through 29-01-1998",

}

Gui, C, Veldhuis, GJ, Koster, TM, Lambeck, P, Berenschot, JW , Gardeniers, JGE & Elwenspoek, MC 1998, Nanomechanical optical devices fabricated with aligned wafer bonding. in The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings. IEEE, Piscataway, pp. 482-487, 11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998, Heidelberg, Germany, 25/01/98. https://doi.org/10.1109/MEMSYS.1998.659805

Nanomechanical optical devices fabricated with aligned wafer bonding. / Gui, C.; Veldhuis, G.J.; Koster, T.M. et al.
The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings. Piscataway: IEEE, 1998. p. 482-487.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Nanomechanical optical devices fabricated with aligned wafer bonding

AU - Gui, C.

AU - Veldhuis, G.J.

AU - Koster, T.M.

AU - Lambeck, Paul

AU - Berenschot, Johan W.

AU - Gardeniers, Johannes G.E.

AU - Elwenspoek, Michael Curt

N1 - Conference code: 11

PY - 1998/1/25

Y1 - 1998/1/25

N2 - This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance

AB - This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance

KW - METIS-112755

KW - EWI-13471

KW - IR-15873

U2 - 10.1109/MEMSYS.1998.659805

DO - 10.1109/MEMSYS.1998.659805

M3 - Conference contribution

SN - 0-7803-4412-X

SP - 482

EP - 487

BT - The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings

PB - IEEE

CY - Piscataway

T2 - 11th Annual International Workshop on Micro Electro Mechanical Systems, MEMS 1998

Y2 - 25 January 1998 through 29 January 1998

ER -