New design methodologies in (111)-oriented silicon wafers

R.E. Oosterbroek; J.W. Berenschot; A.J. Nijdam; G. Pandraud; M.C. Elwenspoek; A. van den Berg

doi:10.1117/12.361243

New design methodologies in (111)-oriented silicon wafers

R.E. Oosterbroek
, J.W. Berenschot
, A.J. Nijdam
, G. Pandraud
, M.C. Elwenspoek
, A. van den Berg

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

22 Downloads (Pure)

Abstract

New methodologies in anisotropic wet-chemical etching of oriented silicon allowing useful process designs combined with smart mask-to crystal-orientation-alignment are presented. The described methods yield smooth, etch-step free surfaces as well as high-quality plan-parallel beams and membranes. With a combination of pre-etching at different depths and passivation steps, structures can be etched at different levels in a wafer. Design rules using the <100>-crystal orientation, supplemented with examples demonstrate the high potential of using <100> oriented wafers in microsystem design.

Original language	English
Title of host publication	Micromachining and Microfabrication Process Technology V
Subtitle of host publication	20-22 September 1999, Santa Clara, California
Editors	James H. Smith, Jean Michel Karam
Place of Publication	Bellingham, WA, USA
Publisher	SPIE
Pages	384-394
Number of pages	11
ISBN (Print)	0-8194-3471-X
DOIs	https://doi.org/10.1117/12.361243
Publication status	Published - 20 Sept 1999
Event	Micromachining and Microfabrication Process Technology V - Santa Clara, United States Duration: 20 Sept 1999 → 22 Sept 1999 Conference number: 5

Publication series

Name	Proceedings of SPIE
Publisher	SPIE
Volume	3874
ISSN (Print)	0277-786X

Conference

Conference	Micromachining and Microfabrication Process Technology V
Country/Territory	United States
City	Santa Clara
Period	20/09/99 → 22/09/99

Keywords

EWI-13210
IR-15832
METIS-112714

Access to Document

10.1117/12.361243

Cite this

Oosterbroek, R. E., Berenschot, J. W., Nijdam, A. J., Pandraud, G., Elwenspoek, M. C., & van den Berg, A. (1999). New design methodologies in (111)-oriented silicon wafers. In J. H. Smith, & J. M. Karam (Eds.), Micromachining and Microfabrication Process Technology V: 20-22 September 1999, Santa Clara, California (pp. 384-394). (Proceedings of SPIE; Vol. 3874). SPIE. https://doi.org/10.1117/12.361243

@inproceedings{0cf6c69c17934760935559fe8262f4cc,

title = "New design methodologies in (111)-oriented silicon wafers",

abstract = "New methodologies in anisotropic wet-chemical etching of oriented silicon allowing useful process designs combined with smart mask-to crystal-orientation-alignment are presented. The described methods yield smooth, etch-step free surfaces as well as high-quality plan-parallel beams and membranes. With a combination of pre-etching at different depths and passivation steps, structures can be etched at different levels in a wafer. Design rules using the <100>-crystal orientation, supplemented with examples demonstrate the high potential of using <100> oriented wafers in microsystem design.",

keywords = "EWI-13210, IR-15832, METIS-112714",

author = "R.E. Oosterbroek and J.W. Berenschot and A.J. Nijdam and G. Pandraud and M.C. Elwenspoek and \{van den Berg\}, A.",

year = "1999",

month = sep,

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doi = "10.1117/12.361243",

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isbn = "0-8194-3471-X",

series = "Proceedings of SPIE",

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pages = "384--394",

editor = "Smith, \{James H.\} and Karam, \{Jean Michel\}",

booktitle = "Micromachining and Microfabrication Process Technology V",

address = "United States",

note = "Micromachining and Microfabrication Process Technology V ; Conference date: 20-09-1999 Through 22-09-1999",

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Oosterbroek, RE, Berenschot, JW, Nijdam, AJ, Pandraud, G, Elwenspoek, MC & van den Berg, A 1999, New design methodologies in (111)-oriented silicon wafers. in JH Smith & JM Karam (eds), Micromachining and Microfabrication Process Technology V: 20-22 September 1999, Santa Clara, California. Proceedings of SPIE, vol. 3874, SPIE, Bellingham, WA, USA, pp. 384-394, Micromachining and Microfabrication Process Technology V, Santa Clara, California, United States, 20/09/99. https://doi.org/10.1117/12.361243

New design methodologies in (111)-oriented silicon wafers. / Oosterbroek, R.E.; Berenschot, J.W.; Nijdam, A.J. et al.
Micromachining and Microfabrication Process Technology V: 20-22 September 1999, Santa Clara, California. ed. / James H. Smith; Jean Michel Karam. Bellingham, WA, USA: SPIE, 1999. p. 384-394 (Proceedings of SPIE; Vol. 3874).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

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AU - Berenschot, J.W.

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AU - Pandraud, G.

AU - Elwenspoek, M.C.

AU - van den Berg, A.

N1 - Conference code: 5

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Y1 - 1999/9/20

N2 - New methodologies in anisotropic wet-chemical etching of oriented silicon allowing useful process designs combined with smart mask-to crystal-orientation-alignment are presented. The described methods yield smooth, etch-step free surfaces as well as high-quality plan-parallel beams and membranes. With a combination of pre-etching at different depths and passivation steps, structures can be etched at different levels in a wafer. Design rules using the <100>-crystal orientation, supplemented with examples demonstrate the high potential of using <100> oriented wafers in microsystem design.

AB - New methodologies in anisotropic wet-chemical etching of oriented silicon allowing useful process designs combined with smart mask-to crystal-orientation-alignment are presented. The described methods yield smooth, etch-step free surfaces as well as high-quality plan-parallel beams and membranes. With a combination of pre-etching at different depths and passivation steps, structures can be etched at different levels in a wafer. Design rules using the <100>-crystal orientation, supplemented with examples demonstrate the high potential of using <100> oriented wafers in microsystem design.

KW - EWI-13210

KW - IR-15832

KW - METIS-112714

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DO - 10.1117/12.361243

M3 - Conference contribution

SN - 0-8194-3471-X

T3 - Proceedings of SPIE

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BT - Micromachining and Microfabrication Process Technology V

A2 - Smith, James H.

A2 - Karam, Jean Michel

PB - SPIE

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Y2 - 20 September 1999 through 22 September 1999

ER -

Oosterbroek RE, Berenschot JW, Nijdam AJ, Pandraud G, Elwenspoek MC, van den Berg A. New design methodologies in (111)-oriented silicon wafers. In Smith JH, Karam JM, editors, Micromachining and Microfabrication Process Technology V: 20-22 September 1999, Santa Clara, California. Bellingham, WA, USA: SPIE. 1999. p. 384-394. (Proceedings of SPIE). doi: 10.1117/12.361243

New design methodologies in (111)-oriented silicon wafers

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