New metal bonding technique during sputtering film deposition

T. Shimatsu, R.H. Mollema, D.J. Monsma, J.C. Lodder

    Research output: Other contributionOther research output

    Original languageUndefined
    Place of PublicationEnschede / MESA DAG
    Publication statusPublished - 11 Jun 1997

    Keywords

    • METIS-115064

    Cite this

    Shimatsu, T., Mollema, R. H., Monsma, D. J., & Lodder, J. C. (1997, Jun 11). New metal bonding technique during sputtering film deposition. Enschede / MESA DAG.