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New metal bonding technique during sputtering film deposition

  • T. Shimatsu
  • , R.H. Mollema
  • , D.J. Monsma
  • , J.C. Lodder

    Research output: Other contribution › Other research output

    Original languageUndefined
    Place of PublicationEnschede / MESA DAG
    Publication statusPublished - 11 Jun 1997

    Keywords

    • METIS-115064

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