Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass

B.H. Timmer, K.M. van Delft, T.D. Dermendjieva-Jansink, Wouter Olthuis, Piet Bergveld, Albert van den Berg

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageUndefined
Title of host publicationProceedings MME 2002
Place of PublicationSinaia, Romania
Pages339-341
Number of pages3
Publication statusPublished - 6 Oct 2002
Event13th Micromechanics Europe Workshop, MME 2002 - Sinaia, Romania
Duration: 6 Oct 20028 Oct 2002

Workshop

Workshop13th Micromechanics Europe Workshop, MME 2002
Abbreviated titleMME
CountryRomania
CitySinaia
Period6/10/028/10/02

Keywords

  • METIS-207404
  • IR-43786

Cite this

Timmer, B. H., van Delft, K. M., Dermendjieva-Jansink, T. D., Olthuis, W., Bergveld, P., & van den Berg, A. (2002). Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In Proceedings MME 2002 (pp. 339-341). Sinaia, Romania.
Timmer, B.H. ; van Delft, K.M. ; Dermendjieva-Jansink, T.D. ; Olthuis, Wouter ; Bergveld, Piet ; van den Berg, Albert. / Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. Proceedings MME 2002. Sinaia, Romania, 2002. pp. 339-341
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author = "B.H. Timmer and {van Delft}, K.M. and T.D. Dermendjieva-Jansink and Wouter Olthuis and Piet Bergveld and {van den Berg}, Albert",
year = "2002",
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isbn = "973-0-02472-3",
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Timmer, BH, van Delft, KM, Dermendjieva-Jansink, TD, Olthuis, W, Bergveld, P & van den Berg, A 2002, Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. in Proceedings MME 2002. Sinaia, Romania, pp. 339-341, 13th Micromechanics Europe Workshop, MME 2002, Sinaia, Romania, 6/10/02.

Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. / Timmer, B.H.; van Delft, K.M.; Dermendjieva-Jansink, T.D.; Olthuis, Wouter; Bergveld, Piet; van den Berg, Albert.

Proceedings MME 2002. Sinaia, Romania, 2002. p. 339-341.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass

AU - Timmer, B.H.

AU - van Delft, K.M.

AU - Dermendjieva-Jansink, T.D.

AU - Olthuis, Wouter

AU - Bergveld, Piet

AU - van den Berg, Albert

PY - 2002/10/6

Y1 - 2002/10/6

KW - METIS-207404

KW - IR-43786

M3 - Conference contribution

SN - 973-0-02472-3

SP - 339

EP - 341

BT - Proceedings MME 2002

CY - Sinaia, Romania

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Timmer BH, van Delft KM, Dermendjieva-Jansink TD, Olthuis W, Bergveld P, van den Berg A. Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In Proceedings MME 2002. Sinaia, Romania. 2002. p. 339-341