Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass

B.H. Timmer, K.M. van Delft, T.D. Dermendjieva-Jansink, Wouter Olthuis, Piet Bergveld, Albert van den Berg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings MME 2002
    Place of PublicationSinaia, Romania
    Pages339-341
    Number of pages3
    Publication statusPublished - 6 Oct 2002
    Event13th Micromechanics Europe Workshop, MME 2002 - Sinaia, Romania
    Duration: 6 Oct 20028 Oct 2002

    Workshop

    Workshop13th Micromechanics Europe Workshop, MME 2002
    Abbreviated titleMME
    CountryRomania
    CitySinaia
    Period6/10/028/10/02

    Keywords

    • METIS-207404
    • IR-43786

    Cite this

    Timmer, B. H., van Delft, K. M., Dermendjieva-Jansink, T. D., Olthuis, W., Bergveld, P., & van den Berg, A. (2002). Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In Proceedings MME 2002 (pp. 339-341). Sinaia, Romania.