Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass

B.H. Timmer, K.M. van Delft, T.D. Dermendjieva-Jansink, Wouter Olthuis, Piet Bergveld, Albert van den Berg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings MME 2002
    Place of PublicationSinaia, Romania
    Pages339-341
    Number of pages3
    Publication statusPublished - 6 Oct 2002
    Event13th Micromechanics Europe Workshop, MME 2002 - Sinaia, Romania
    Duration: 6 Oct 20028 Oct 2002

    Workshop

    Workshop13th Micromechanics Europe Workshop, MME 2002
    Abbreviated titleMME
    CountryRomania
    CitySinaia
    Period6/10/028/10/02

    Keywords

    • METIS-207404
    • IR-43786

    Cite this

    Timmer, B. H., van Delft, K. M., Dermendjieva-Jansink, T. D., Olthuis, W., Bergveld, P., & van den Berg, A. (2002). Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In Proceedings MME 2002 (pp. 339-341). Sinaia, Romania.
    Timmer, B.H. ; van Delft, K.M. ; Dermendjieva-Jansink, T.D. ; Olthuis, Wouter ; Bergveld, Piet ; van den Berg, Albert. / Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. Proceedings MME 2002. Sinaia, Romania, 2002. pp. 339-341
    @inproceedings{afba449f908a495d98f1f0ff70053430,
    title = "Non-destructive test for anodic bonding characterisation of {"}thick{"} silicon nitride bonded to glass",
    keywords = "METIS-207404, IR-43786",
    author = "B.H. Timmer and {van Delft}, K.M. and T.D. Dermendjieva-Jansink and Wouter Olthuis and Piet Bergveld and {van den Berg}, Albert",
    year = "2002",
    month = "10",
    day = "6",
    language = "Undefined",
    isbn = "973-0-02472-3",
    pages = "339--341",
    booktitle = "Proceedings MME 2002",

    }

    Timmer, BH, van Delft, KM, Dermendjieva-Jansink, TD, Olthuis, W, Bergveld, P & van den Berg, A 2002, Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. in Proceedings MME 2002. Sinaia, Romania, pp. 339-341, 13th Micromechanics Europe Workshop, MME 2002, Sinaia, Romania, 6/10/02.

    Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. / Timmer, B.H.; van Delft, K.M.; Dermendjieva-Jansink, T.D.; Olthuis, Wouter; Bergveld, Piet; van den Berg, Albert.

    Proceedings MME 2002. Sinaia, Romania, 2002. p. 339-341.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    TY - GEN

    T1 - Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass

    AU - Timmer, B.H.

    AU - van Delft, K.M.

    AU - Dermendjieva-Jansink, T.D.

    AU - Olthuis, Wouter

    AU - Bergveld, Piet

    AU - van den Berg, Albert

    PY - 2002/10/6

    Y1 - 2002/10/6

    KW - METIS-207404

    KW - IR-43786

    M3 - Conference contribution

    SN - 973-0-02472-3

    SP - 339

    EP - 341

    BT - Proceedings MME 2002

    CY - Sinaia, Romania

    ER -

    Timmer BH, van Delft KM, Dermendjieva-Jansink TD, Olthuis W, Bergveld P, van den Berg A. Non-destructive test for anodic bonding characterisation of "thick" silicon nitride bonded to glass. In Proceedings MME 2002. Sinaia, Romania. 2002. p. 339-341