TY - JOUR
T1 - Novel cooling strategy for electronic packages: directly injected cooling
AU - Wits, Wessel Willems
AU - Vaneker, Thomas H.J.
AU - Mannak, J.H.
AU - Legtenberg, Rob
PY - 2009
Y1 - 2009
N2 - This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and highly integrated cooling strategy for electronic packages is presented. Standardized package types, as for instance ball grid array packages, are equipped with a directly injected cooling support. The developed concept is a new and very cost effective concept, as fewer productions steps and fewer procured parts are required compared to traditional cooling concepts. The new concept is also easily scalable, as multiple components on an electronic product can be cooled both uniformly across the product and simultaneously. This increases design flexibility and results in electronic products with advantages in terms of performance, compactness, weight and production efficiency.
AB - This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and highly integrated cooling strategy for electronic packages is presented. Standardized package types, as for instance ball grid array packages, are equipped with a directly injected cooling support. The developed concept is a new and very cost effective concept, as fewer productions steps and fewer procured parts are required compared to traditional cooling concepts. The new concept is also easily scalable, as multiple components on an electronic product can be cooled both uniformly across the product and simultaneously. This increases design flexibility and results in electronic products with advantages in terms of performance, compactness, weight and production efficiency.
KW - Jet impingement cooling
KW - Thermal management
KW - PCB cooling
U2 - 10.1016/j.cirpj.2008.10.001
DO - 10.1016/j.cirpj.2008.10.001
M3 - Article
VL - 1
SP - 142
EP - 147
JO - CIRP journal of manufacturing science and technology
JF - CIRP journal of manufacturing science and technology
SN - 1755-5817
IS - 3
ER -