Novel cooling strategy for electronic packages: directly injected cooling

Wessel W. Wits*, Thomas H.J. Vaneker, Jan H. Mannak, Rob Legtenberg

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

10 Citations (Scopus)
4 Downloads (Pure)


This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and highly integrated cooling strategy for electronic packages is presented. Standardized package types, as for instance ball grid array packages, are equipped with a directly injected cooling support. The developed concept is a new and very cost effective concept, as fewer productions steps and fewer procured parts are required compared to traditional cooling concepts. The new concept is also easily scalable, as multiple components on an electronic product can be cooled both uniformly across the product and simultaneously. This increases design flexibility and results in electronic products with advantages in terms of performance, compactness, weight and production efficiency.
Original languageEnglish
Pages (from-to)142-147
JournalCIRP journal of manufacturing science and technology
Issue number3
Publication statusPublished - 2009


  • Jet impingement cooling
  • Thermal management
  • PCB cooling
  • 2023 OA procedure


Dive into the research topics of 'Novel cooling strategy for electronic packages: directly injected cooling'. Together they form a unique fingerprint.

Cite this