Novel cooling strategy for electronic packages: directly injected cooling

Wessel Willems Wits, G.J.H.M. Brok, J.H. Mannak, R. Legtenberg

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

This publication discusses domain integration of various engineering disciplines as an effective methodology to design new and innovative products. A case study illustrates how this approach is applied to the design process of a high performance electronic product. A novel and improved method for the cooling of electronic packages is presented. Standard package types, as for instance ball grid arrays, are equipped with directly injected cooling. The developed design is a very cost effective solution, as fewer productions steps and fewer procured parts are required compared to traditional cooling. The new design is also easily scalable, as multiple components on an electronic product can be cooled both uniformly and simultaneously. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency.
Original languageEnglish
Title of host publicationCIRP Design Conference 2008
EditorsF.J.A.M. van Houten, J. Miedema, D. Lutters
Place of PublicationEnschede, the Netherlands
PublisherUniversity of Twente
Pages-
Number of pages4
ISBN (Print)9789036526340
Publication statusPublished - 7 Apr 2008
Event18th CIRP Design Conference 2008: Design Synthesis - University of Twente, Enschede, Netherlands
Duration: 7 Apr 20089 Apr 2008
Conference number: 18

Conference

Conference18th CIRP Design Conference 2008
CountryNetherlands
CityEnschede
Period7/04/089/04/08

Keywords

  • METIS-255769
  • Electronic packages
  • PCB cooling
  • Thermal management
  • IR-76877
  • Jet impingement cooling

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